Hey everyone, thanks for the suggestions!
As Stuart said, the plan is to set up a thermal vac chamber for a
couple of ArduSat related purposes. Firstly I need to outgas regular
FR4 PCB material before it goes into orbit: FR4 is notorious for
venting material when placed in a vacuum, which is bad when there are
optics in the satellite for 3 cameras and a spectrometer. If it's
cycled through a vacuum chamber before integration with the rest of
the satellite it'll outgas in the chamber, and then be fine when it
reaches orbit.
The second purpose is to try some thermal transfer experiments, and in
particular conduction through the flight PCBs. I don't have access to
a thermal imaging camera unfortunately but my general plan is to use
dry ice and direct contact through a metal mount to reduce the
temperature, and IR to raise the temperature of the board while it's
in the vac chamber. Then I can use an IR temperature sensor to see how
the board reacts, such as how quickly it can radiate out excess heat
once it's been raised to 85C or so and then the heat source removed.
Stuart's links are good for background, and there's also this talk I
did recently at LCA:
http://www.youtube.com/watch?v=HQ0wLmlRqpo
Cheers
Jon