Deadline extended: AI-ML Systems 2023 (Final call for papers)

64 views
Skip to first unread message

Raj Sharma

unread,
Jul 18, 2023, 3:52:41 PM7/18/23
to Women in Machine Learning
--------------------------------------------------------------------------------------
AI-ML Systems 2023
3rd International Conference on AI-ML Systems
October 25-28, 2023  |  The Chancery Pavilion, Bengaluru, India

https://www.aimlsystems.org
---------------------------------------------------------------------------------------

We are pleased to announce the 3rd International Conference AI-ML Systems 2023 to be physically held in Bengaluru from 25th to 28th October 2023.

AI-ML Systems has been established as one of the looked-after research conferences in the areas of Systems enabling AI/ ML developments, AI/ ML for various system development, and new frontiers in AI / ML algorithms and applications.

CALL FOR PAPERS
We invite you to submit your unpublished research on the intersection of AI/ML techniques and systems engineering to AIm-ML System 2023. Any research work exploring how AI/ ML techniques benefit from computational systems research and how they can aid in the design of computational and socio-economic systems is a good candidate for submission.

Put up your submission in one of the following tracks:
  1. Research Papers Track
  2. Industry Track
  3. Demos and Exhibit Track

SUBMISSION LINK
https://cmt3.research.microsoft.com/AIMLSystems2023

TOPICS OF INTEREST
  • Systems for AI/ML: CPU/GPU architectures, specialized/ embedded hardware, data-intensive systems, production deployment challenges, programming models/ languages/ abstractions, compilers/runtime, efficient data preparation/ processing/visualization, testing/ debugging/ monitoring, cloud computing, "as-a-service" options, tiny machine learning, embedded/edge AI, distributed/parallel learning algorithms, and MLOps.
  • AI/ML for Systems: AI/ML for VLSI and architecture design; AI/ML in compiler optimization; AI/ML in data management - including database optimizations, virtualization, etc.; AI/ML for networks - design of networks, load modeling, etc.; AI/ML for power management - green computing, power models, etc.; AI/ML for Cloud Computing; AI/ML for IOT
  • AI ML Algorithms and Applications for socio-economic design: Deep Learning Architecture and applications, Computer Vision and Image processing, Natural language processing and understanding, Speech signal processing and Socio-Economic Systems, Fairness and biases of models, Explainability, transparency, and interpretability of AI systems Privacy, security, and ethics in AI. AI/ML for cyber-physical systems; Fairness, interpretability, and explainability for ML applications; Privacy and security in AI/ML systems; Sustainability in AI/ML systems; Applications of AI/ML in financial systems.

IMPORTANT DATES

Research Paper Track (https://www.aimlsystems.org/2023/callresearch/)
  • Paper submissions due date: July 26, 2023, 11:59 pm AoE  (Extended Deadline)
  • Author notifications: August 30, 2023
  • Camera-ready deadline: September 20, 2023
Industry Track (https://www.aimlsystems.org/2023/callindustry/)
  • Paper submissions due date: July 26, 2023, 11:59 pm AoE.  (Extended Deadline)
  • Author notifications: August 30, 2023
  • Camera-ready deadline: September 20, 2023
Demo and Exhibits Track (https://www.aimlsystems.org/2023/demos/ ):
  • Submission deadline: 30th July 2023, AoE
  • Notification of Acceptance: 8th September 2023, AoE
  • Final Submission: 30th September 2023, AoE

INSTRUCTIONS TO AUTHORS

Research papers must not exceed 8 pages, excluding appendix, acknowledgments, and bibliography. Only electronic submissions in PDF format using the ACM sigconf template will be considered.
(see https://www.acm.org/publications/proceedings-template )

Papers can be submitted under any of the three main topics listed above. Authors are required to make a primary topic selection, with optional secondary topics for each paper. There is no cap on the number of papers accepted under each topic. We will accept all papers that meet the high quality and innovation levels required by the AIMLSystems conference. All papers that are accepted will appear in the proceedings.

All accepted papers will be presented as posters at AIMLSystems 2023, but a select subset of them will be given a “conventional” (oral) presentation slot during the conference. However, all accepted papers will be treated equally in the conference proceedings, which are the persistent, archival record of the conference.

ORGANISING COMMITTEE

General Co-Chairs
  • Jitendra Malik, University of California, Berkeley, USA
  • Kavita Bala, Cornell University, USA
  • Ramachandran Ramjee, Microsoft Research, India
Technical Program Committee Co-Chairs
  • R. Venkatesh Babu, IISc, Bangalore, India
  • Dileep Kalathil, Texas A&M University, USA
  • Deepti Ghadiyaram, Runway, USA
Industry Track Co-Chairs
  • Atul Batra, Startup/Product Advisor, India
  • Milind Gandhe, Machine Intelligence and Robotics CoE (MINRO), IIIT Bangalore, India
  • Rahul Ghosh, Walmart Global Tech, India
  • Veena Mendiratta, Northwestern University, USA
Demos and Exhibits Co-Chairs
  • Anupam Purwar, Amazon, India
  • Swaroop Hangal, NewSpace Research and Technologies, India
  • Tridib Mukherjee, Games24x7, India
Panel Co-Chairs
  • Subrato De, Qualcomm, USA
  • Supratik Mukhopadhyay, Louisiana State University, USA
  • Debdoot Mukherjee, Meesho, India
Publication Chair
  • Anirban Chakraborty, IISc, Bangalore, India
Web Co-Chairs
  • Siddharth D Jaiswal, IIT Kharagpur, India
  • Vivek Yadav, IIIT Bangalore, India
Publicity Co-Chairs
  • Arnab Bhattacharya, IIT Kanpur, India
  • Alessandro Falcetta, Politecnico di Milano, Italy
  • Rekha Singhal, TCS, USA
  • Shantanu Pal, Deakin University, Australia
  • Sumant Kulkarni, Kloud9, India
Sponsorship Co-Chairs
  • Giridhar Mandyam, Qualcomm, USA
  • Rajeev Shorey, IIT Delhi, India
Steering Committee
  • Uday Desai, IIT Hyderabad, India Anurag Kumar, IISc, India
  • Giridhar Mandyam, Qualcomm, USA Huzur Saran, IIT Delhi, India
  • Rajeev Shorey, IIT Delhi, India
  • G. Venkatesh, SASKEN, India
Reply all
Reply to author
Forward
0 new messages