Welcome to the website of Optimal Thermal Solutions. We are a Dutch engineering agency specialized in thermal management of electronics. Since 2003 we are active in the market as an absolutely independent provider of thermal solutions. Please find here further information about our service and products. Should you require additional information please feel free to contact us.
The various courses that OTS offers, will give you in-depth comprehension of the concept of thermal management of electronics. OTS also provides in theme courses like LED or infrared. Last but not least we offer thermal management courses in general. Please find below mentioned an overview of our courses:
For nearly every thermal challenge there is a solution. However not always applying a larger heatsink and a stronger fan are sufficient. OTS helps and advises you by achieving the best possible cooling solution: both for air- as well as for liquid cooling.
Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.
These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling air gaps (voids), and offering long-term stability within components.
Multi-award-winning formulations in various mediums allow Henkel to provide thermal management materials that offer essential heat dissipation for applications within numerous markets. These include automotive, consumer, telecom/datacom, power and industrial automation, computing, and communication, among others.
As electronic systems integrate more capability into increasingly challenging, complex designs and compact footprints, efficient heat control is necessary. Doing so effectively allows you to maximize performance and limit heat-related failures within devices.
Knowing the requirements in your application for each of the above can help you decide whether you need a resin, liquid, or solid-state thermal management solution and whether pads, liquids, adhesives, tapes, or films are the right thermal product for use in your assembly. Check out our e-Catalog to select the right thermal material for your needs.
Devices with thicker gaps between heat sinks and electronic components, uneven surface topography, and rough surface textures need an interface material with greater conformability, higher thermal performance, and simplified application.
GAP PAD materials reduce thermal resistance and achieve specific thermal and conformability characteristics in components with uneven and rough surfaces. Manual or automated application, there is no dispensing equipment required and material is easily reworkable. Help reduce vibration stress for shock dampening in a range of applications.
Devices with more complex electronic designs, highly intricate topographies, and multi-level surfaces need an interface material to enhance thermal performance and enable easier dispensing application for high-volume manufacturing operations.
Thermal liquid gap filler materials can be used on many platforms, providing better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. Application volume and pattern are completely adaptable to suit a wide range of applications.
Devices with thinner gaps between heat sinks and electronic components need a solution that can minimize thermal resistance from the external package of a power semiconductor to the heat sink, electrically isolate the semiconductor from the heat sink, and provide sufficient dielectric strength to withstand high voltage.
Creating a strong bond between components and heat sinks to reduce the need for screws and clips, Henkel thermally conductive adhesives in pad, liquid, and laminate mediums also allow reliable, long-lasting connection and effective heat dissipation in devices.
Phase change material products replace grease as the interface between power devices and heat sinks to provide effective thermal performance in components. These products can be integrated into a fully automated process, giving customers fast and flexible processing for mass production and high throughput.
Noren heat exchanger fulfills its commitment to absolute excellence representing the best choice in engineering and thermal technologies. We offer you high-quality heat exchangers and custom Thermal designs that maintain a low operating cost without refrigerants for its operation compared with air conditioners.
Noren Thermal Solutions has more than 50 years of expertise and the tools to fulfill your thermal management technology needs. Noren offers you a maintenance-free heat exchanger, easy to install and with the capacity to operate for up to ten years, helping to create the optimal conditions for your cabinets. For this reason, Noren is the best-qualified supplier in thermal solutions technology, going hand in hand with the Excellency in service attention.
Simcenter includes comprehensive, best-in-class thermal simulation capabilities that can help you understand the thermal characteristics of your product and, subsequently, tailor your thermal management solution for optimal performance.
Thermal conduction occurs when heat transfers through a solid, from the higher-temperature to lower-temperature regions. This happens spontaneously and continues until a state of thermal equilibrium is attained. Typical examples of conduction in everyday life include the handle of a pot of boiling water getting hot, the increase in temperature of the outer wall of a copper pipe as hot water passes through it, or the spontaneous chill you experience when you consume a spoonful of ice cream.
Convection is a major heat transfer pathway that is present in a wide range of applications, processes and natural phenomena. Many products rely on a robust heat management strategy for optimal performance and durability. Optimizing convective heat transfer in these devices, either by strategic placement of components or the use of other working fluids, is a complex problem. Simcenter offers robust capabilities for addressing convection in the design of products.
Radiative heat transfer occurs when objects radiate electromagnetic energy due to temperature. This energy, typically located in the infrared region of the wave spectrum, is also known as thermal radiation.
Simcenter provides you with the capabilities to solve the most complex problems involving radiative heat transfer, such as sophisticated radiation analysis and radiative heating models. Advanced radiation methods such as deterministic and Monte Carlo ray tracing and nongray multiband radiative heat transfer are available.
Simcenter provides a comprehensive set of tools to perform orbital thermal analysis integrated into your design and engineering process. It allows you to maximize efficiency with an automated solution that carries out the thermal analysis in a single pass.
Simcenter helps resolve engineering challenges early in the design process and is a valuable tool for predicting and understanding thermal physics for space-bound, orbiting and interplanetary vehicles.
In our continuous quest for improvement and innovation in electrification, our expertise in thermal management and powertrain systems allows us to offer a wide range of hardware and software solutions addressing the entire mobility market for vehicles equipped with internal combustion engines (gasoline or diesel), hybrid powertrain systems (plug-in or not, available in 48V or high voltage), or pure electric powertrain (electric or fuel cell vehicles). The Power Division provides innovative solutions that enable better autonomy, optimized performance, and improved in-car comfort.
Our technologies are designed for all types of mobility, whether for passenger vehicles, utility vehicles for last-mile delivery, trucks for long-distance deliveries, or 2-, 3-, or 4-wheel vehicles, anywhere in the world.
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