Josh & Yahya,
I will speak the first 10 minutes at a high level about our engagements with UCLA and local industry---hope to see you for the first part Yahya.
See attached flyer.
Register today if you can, space will fill up and I want to make sure you have a spot:
We will focus on 2 topics:
1
Advances in HFSS Workflow:
*Importing & solving ECAD / PCB Layout designs in HFSS
*Feed Network & Finite Array Design
Traditional embedded 2.5D and 3D EM solvers in PCB layout environments lack accuracy due to mathematical and geometric assumptions.
The market has proven their need for more confidence and precise simulation results before build.
We will show 3D EM analysis to solve stackup/layered-based geometry (e.g. importing PCB and traces/nets from Cadence, Mentor, Altium)
2
Multiphysics: RF Heat loss coupled both ways to structural changes
ANSYS works with most of the critical industries that incorporate RF designs into their systems: aerospace & defense, telecommunications, vehicle electrification, mobile phones, and components related to the "Internet of Things."
Come learn about how these advanced industries are combining RF and structural mechanics to push the physics of their designs to drive up performance and heat dissipation and limit weight & cost.
Q & A:
ANSYS engineers / PhDs in RF will be present--bring your questions, whether you are starting out with 3D EM analysis or if you are advanced in the field.