Fwd: [D&R] ARM & Cadence IP Partnership for Faster SoC Design | In 2020, 10nm Will Occupy 55% of Revenue: TSMC | Selecting an Optimized ADC for a Wireless AFE

[Younus Syed]

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From: D&R SoC News Alert <SoC-Ne...@design-reuse.com>
Date: Mon, Mar 23, 2015 at 9:29 PM
Subject: [D&R] ARM & Cadence IP Partnership for Faster SoC Design | In 2020, 10nm Will Occupy 55% of Revenue: TSMC | Selecting an Optimized ADC for a Wireless AFE
To: younu...@gmail.com

D&R SoC News Alert www.design-reuse.com March 23, 2015 - UBM Tech In this issue • ARM & Cadence IP Partnership for Faster SoC Design • In 2020, 10nm Will Occupy 55% of Revenue: TSMC • Selecting an Optimized ADC for a Wireless AFE Younus, Welcome to the issue of March 23, 2015 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community. SPONSORED BY SYNOPSYS Learn how high-quality DesignWare® IP enables you to lower risk and speed time-to-market for SoC designs. White Paper: Addressing IP Integration & Software Development Challenges to Accelerate SoC Time-to-Market Webinar: Meeting 90-nm to 10-nm Physical IP Design Requirements for Wearables & Application Processors Tuesday, Mar 31, 2015 Webinar: Choosing the Optimal Multiprotocol PHY IP for Your SoC Thursday, Apr 2, 2015 NEW IP/SOC PRODUCTS Camera SLVS-EC/sub-LVDS combo Receiver 2.5Gbps 8/12-Lane from Curious 2.5 Gb/s Digital RF Up Converter for AD9739A from MVD Cores 12-bit 80MS/s Ultra-Efficient Dual ADC from S3 Group 10-bit, 300MSPS, 3.3V Compact Quadruple Current Steering Video DAC in GF40LP25 from Synopsys Digital Video Scaling Engine from Zipcores SHA 256-bit hash generator from Noesis Technologies Network-on-Chip SoC Solution IP from Aims Technology eMMC 5.0 Verification IP from eInfochips Most popular IP of last week: Intelligent Vision Processor from CEVA INDUSTRY ARTICLES Selecting an Optimized ADC for a Wireless AFE Defend encryption systems against side-channel attacks LTE-A Release 12 transmitter architecture: analog integration Dynamically controlled logic gate design for all power modes COMMENTARY/ANALYSIS In 2020, 10nm Will Occupy 55% of Revenue: TSMC North American Semiconductor Equipment Industry Posts February 2015 Book-to-Bill Ratio of 1.02 Small Powerful Systems Give Rise to Medical Semiconductor Sales Industrial IoT Drives Microsemi-Vitesse Merger Broadcom v ASICs, Part 2 SEMI Reports 2014 Global Semiconductor Equipment Sales of $37.5 Billion NXP-Freescale Merger to Result in World’s Eighth-Largest Chipmaker and Pose Threat to Other Players, IHS Says IN THE NEWS IP/SOC PRODUCTS Xilinx Announces Availability of 100G RS-FEC IP for Data Center, Service Provider, and Enterprise Applications eInfochips improves reliability for avionics systems with new ARINC 429 Verification IP BUSINESS Cadence and ARM Announce Strategic IP Interoperability Agreement Imagination Technologies: Interim update Kilopass Focuses on Market and Roadmap Expansion After Sidense Patent Litigation Microsemi Corporation to Acquire Vitesse Semiconductor Corporation Ericsson acquires telecom IT services business in China ISSI Enters Into A Definitive Merger Agreement To Be Acquired By Consortium For $19.25 Per Share MPEG LA Expands HEVC License Coverage DEALS / SUCCESS STORIES Valens Selects Silicon Creations' SerDes IP for the Colligo Chipsets Rockchip Licenses Arteris FlexNoC Fabric IP for RK Series SoCs Argon Design licenses Argon Streams VP9 to Chips&Media Hycon Technology Selects Andes N8 CPU Core for Next Generation High-End 24-bit Analog-to-Digital Converter EMBEDDED SYSTEMS Chukong Technologies and Imagination collaborate on the latest version of the Cocos2d-x game engine FPGA Xilinx Enables Any Media over Any Network with Comprehensive Suite of All Programmable Professional Video Solutions Compelling OTN Solutions for 200G and 400G to be Demonstrated by Altera on its Arria 10 FPGAs at OFC 2015 FABLESS / IDM Cavium Adds Support for NVIDIA GPU Accelerators in 64-bit ARMv8-A ThunderX Processor Family DESIGN METHODOLOGIES Cadence and Intel Collaborate to Release 14nm Library Characterization Reference Flow for Customers of Intel Custom Foundry Synopsys Enables Continuous Debug Innovation with More Than 200 VC Apps Now Available on the Verdi Platform Microsemi and OneSpin Solutions Target High-reliability Design Verification with Formal-based FPGA Equivalency Checking Solution OTHER Research Project "Power Control" Aims for the Increase of Energy Efficiency in Industrial Facilities Kilopass to Exhibit at GOMACTech-15 Omnitek's video IP-cores prove a hit with Xilinx customers prpl Foundation Announces Formation of Security Working Group to Define Open Framework Addressing Next Generation Security Requirements of Future Connected Devices HSA Foundation Launches New Era of Pervasive, Energy-Efficient Computing with HSA 1.0 Specification Release INDUSTRY EXPERT BLOGS SoCs in New Context Look beyond PPA SemiWiki - Pawan Fangaria Apple's Ax Chronicle SemiWiki - Majeed Ahmad Closure: Kilopass v. Sidense SemiWiki - Daniel Nenni CDNLive 2015: Cadence Innovus Implementation System Fires Up ARM Cortex-A72 Processor Industry Insights Blog - Richard Goering , Cadence How do you Verify the AMBA System Level Environment? VIP Experts Blog - Synopsys ARM & Cadence IP Partnership for Faster SoC Design SemiWiki - Eric Esteve ARM Shooting For 20% Of Server Market By 2020 Mannerisms - David Manners Programming AXI-ACE VIP to Generate Error Scenarios VIP Experts Blog - Synopsys ARM-Cadence IP Deal Propels Engineering Innovation Ahead: Martin Lund The Fuller View Blog - Brian Fuller Does your VIP need a GUI? Arrow Devices Blog - Sudhanshu A R, Arrow Devices Mobile World Congress: Two New Audio IP Announcements The Fuller View Blog - Brian Fuller Got something to say? Then why not write your own blog on D&R? Contact us if you're interested. Featured Blog POWER FIRST "Subduing The Power Management Storm" by Duncan Bremner, CTO, sureCore Limited Read now >> QUICK LINKS Search for Silicon IP Search for Verification IP Search for Software IP Find an Expert Industry Articles Latest News Tool Demos Free IP Cores CONTACT Support / Sales: North America:     +1 (408) 834-7559     Contact Us International:     +33 476 21 31 02     Contact Us World Headquarters: Design And Reuse S.A. 12 rue Ampere 38 000 Grenoble France REGISTER: If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. 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