Hi Garth,
I can't really see sufficient detail around there, but here's some
pointers.
First, is it actually that bad? Any chance you can take a more
detailed close up?
The pads rely on the plating from the bottom pad to the top pad. That
implies a good solder joint with solder that wets well up to the top-
side of the board, assuming there is also some plating in the via/
header hole. How reliable do you think that might have been before
you did your desoldering? Was there much sign of solder on the
topside?
The pads only have four incoming copper runs from the pour that leads
from the pad on the cap to the pad on the header. The solder mask
prevents the solder flowing over that gap and bridging it better.
Perhaps carefully clearing away some soldermask and tinning the link
between the pad and the surrounding pour will help.
When you put the headers back in, make sure you use a heap of extra
flux, and a heap of solder to let it flow back through the board. I
don't know what that header plugs into but if you have the chance to
raise the header off the board (ie it doesn't need to be flush with
the arduino headers) and you want some more reassurance that the
joints are good, you can leave it sticking a millimetre or so proud
and check that the solder flows through.
hope that helps