COOL Chips 29 ポスター投稿のご案内
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橋本浩二
Mar 12, 2026, 2:24:51 AMMar 12
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SWoPP MLの皆様
お世話になっております。
福岡大学の橋本と申します。
本MLをお借りして、COOL Chips 29 の ポスターセッション投稿（オンサイト発表）をご案内いたします。
重複してお受け取りの際は何卒ご容赦下さい。
皆様からの積極的な投稿をお待ちしております。研究成果の発表および試作デモンストレーションの場として、また若手研究者・学生の発表の機会として是非ご活用ください。
アブストラクトの投稿は1ページですが、図表だけに限ってもう1ページを追加可能です。
アクセプトされれば論文集に掲載されます。
また本会議場にて1,2分程度のショートプレゼンテーションを行っていただきます。
下記EasyChairサイトでの投稿を受け付けております：
https://easychair.org/conferences/?conf=coolchips29
なお、投稿締め切りは3/20としておりますが、延長を検討しております。
どうぞよろしくお願いいたします。
---------------------------------------------------------------------------
IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 29
Takeda Hall, The University of Tokyo, Tokyo, Japan
April 15 - 17, 2026
https://www.coolchips.org
CALL FOR CONTRIBUTIONS
( POSTER PRESENTATIONS )
---------------------------------------------------------------------------
* Submission site: https://easychair.org/conferences/?conf=coolchips29
* Author Schedule for Posters:
- Mar. 20, 2026: Poster Abstract Submission (may be rescheduled)
- Mar. 23, 2026: Poster Acceptance Notified (may be rescheduled)
---------------------------------------------------------------------------
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 29 is to be held in Tokyo on April 15-17, 2026, and is targeted at the architecture, design and implementation of chips and systems with special emphasis on the areas listed below.
Contributions are solicited in the following areas:
- Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.
Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. In addition, one page may be added optionally for figures or tables only. Please be careful not to put the main text of your abstract into the additional second page.
They are refereed primarily based on their relevance to the conference. We welcome submissions presenting works in progress or reporting preliminary results, in any of the conference themes. Accepted abstracts will be published in the Proceedings of the COOL Chips.
All poster presenters will be given the opportunity to present their work in short talks at Lightning Talk Session. Therefore, at least one of the authors must be registered at the conference.
[Best Poster Award]
Speaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the “Best Poster Award of COOL Chips.”
Award Committee:
Chaired by COOL Chips Poster Chair
Members:
PC Chairs, Vice Chair and Poster Chair
(Ryusuke Egawa, Yasutaka Wada, Ryuichi Sakamoto, Thiem Van Chu and Koji Hashimoto)
[Travel grants]
COOL Chips 29 provides travel grants to selected students to attend the conference. Poster presenters are also eligible for travel grants. It is to encourage student participation at the conference through the generous support of IEEE Computer Society Technical Committee on Microprocessing and Microcomputers.
This grant encourages participation by students who would normally find it difficult to attend.
Students who wish to apply it should read the following website carefully :
https://www.coolchips.org/2026/cool-chips-28-travel-grants/
=========
お世話になっております。
福岡大学の橋本と申します。
本MLをお借りして、COOL Chips 29 の ポスターセッション投稿（オンサイト発表）をご案内いたします。
重複してお受け取りの際は何卒ご容赦下さい。
皆様からの積極的な投稿をお待ちしております。研究成果の発表および試作デモンストレーションの場として、また若手研究者・学生の発表の機会として是非ご活用ください。
アブストラクトの投稿は1ページですが、図表だけに限ってもう1ページを追加可能です。
アクセプトされれば論文集に掲載されます。
また本会議場にて1,2分程度のショートプレゼンテーションを行っていただきます。
例年同様、ポスター優秀賞を設ける予定となっております。聴講者の皆様に投票していただき、受賞者を決定いたします。ぜひとも、聴講と併せてポスター発表をご検討のほどよろしくお願いいたします。
またトラベルグラントの申請も可能です。
下記EasyChairサイトでの投稿を受け付けております：
https://easychair.org/conferences/?conf=coolchips29
なお、投稿締め切りは3/20としておりますが、延長を検討しております。
どうぞよろしくお願いいたします。
---------------------------------------------------------------------------
IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 29
Takeda Hall, The University of Tokyo, Tokyo, Japan
April 15 - 17, 2026
https://www.coolchips.org
CALL FOR CONTRIBUTIONS
( POSTER PRESENTATIONS )
---------------------------------------------------------------------------
* Submission site: https://easychair.org/conferences/?conf=coolchips29
* Author Schedule for Posters:
- Mar. 20, 2026: Poster Abstract Submission (may be rescheduled)
- Mar. 23, 2026: Poster Acceptance Notified (may be rescheduled)
---------------------------------------------------------------------------
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 29 is to be held in Tokyo on April 15-17, 2026, and is targeted at the architecture, design and implementation of chips and systems with special emphasis on the areas listed below.
Contributions are solicited in the following areas:
- Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.
Extended abstract submissions should be ONE page, formatted using standard two-column IEEE format. In addition, one page may be added optionally for figures or tables only. Please be careful not to put the main text of your abstract into the additional second page.
They are refereed primarily based on their relevance to the conference. We welcome submissions presenting works in progress or reporting preliminary results, in any of the conference themes. Accepted abstracts will be published in the Proceedings of the COOL Chips.
All poster presenters will be given the opportunity to present their work in short talks at Lightning Talk Session. Therefore, at least one of the authors must be registered at the conference.
[Best Poster Award]
Speaker of the best poster of COOL Chips, IEEE Symposium on Low-Power and High-Speed Chips, will be awarded as the “Best Poster Award of COOL Chips.”
Award Committee:
Chaired by COOL Chips Poster Chair
Members:
PC Chairs, Vice Chair and Poster Chair
(Ryusuke Egawa, Yasutaka Wada, Ryuichi Sakamoto, Thiem Van Chu and Koji Hashimoto)
[Travel grants]
COOL Chips 29 provides travel grants to selected students to attend the conference. Poster presenters are also eligible for travel grants. It is to encourage student participation at the conference through the generous support of IEEE Computer Society Technical Committee on Microprocessing and Microcomputers.
This grant encourages participation by students who would normally find it difficult to attend.
Students who wish to apply it should read the following website carefully :
https://www.coolchips.org/2026/cool-chips-28-travel-grants/
=========
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