COOL Chips 26 - Call for Contributions
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Ryohei KOBAYASHI
Dec 15, 2022, 8:48:50 AM12/15/22
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SWoPP ML皆様
（重複してお受け取りの際は何卒ご容赦下さい。)
お世話になっております．
筑波大学の小林 諒平です．
本MLをお借りして，COOL Chips 26 の論文募集についてご案内いたします．
IEEE Micro特集号およびIEICE英文誌小特集へのSelected Papers推薦等を
企画している他，"Cool Software"として，ソフトウェアおよびその開発に
関する投稿も広く募集しております．
HW・SW問わず，投稿をご検討いただけますと幸いです．
どうぞよろしくお願い申し上げます．
---------------------------------------------------------------------------
IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 26
Takeda Hall, The University of Tokyo, Tokyo, Japan
April 19 - 21, 2023
http://www.coolchips.org
CALL FOR CONTRIBUTIONS
---------------------------------------------------------------------------
* Submission site: https://easychair.org/conferences/?conf=coolchips26
* Author Schedule for Technical Papers:
- Feb. 10, 2023: Paper / Extended Abstract Submission (Web site)
- Mar. 17, 2023: Acceptance Notified (by e-mail)
- Mar. 31, 2023: Final Manuscript Submission
* Author Schedule for Posters:
- Mar. 24, 2023: Poster Abstract Submission (Web site)
- Mar. 27, 2023: Poster Acceptance Notified (by e-mail)
---------------------------------------------------------------------------
COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications.
The COOL Chips 26 is to be held in Tokyo on April 19-21, 2023,
and is targeted at the architecture, design and implementation of chips
with special emphasis on the areas listed below.
All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the IEEE Micro
(https://publications.computer.org/micro/) and the special section
in the IEICE Transactions on Electronics
(https://search.ieice.org/bin/index.php?category=C&lang=E).
Contributions are solicited in the following areas:
- *Low Power-High Performance Processors* for AI, IoT, Multimedia,
Digital Consumer Electronics, Mobile, Graphics, Encryption,
Robotics, Automotive, Networking, Medical, Healthcare, and
Biometrics.
- *Novel Architectures and Schemes* for Single Core, Multi/Many-Core,
NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.
- *Cool Software* including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low
Power Application Techniques.
Proposals should should be organized in a full paper format (6 pages)
or an extended abstract format (up to 3 pages) describing the topic
to be presented. If the proposal is a not-yet-announced product,
and you would like to keep the submission confidential,
please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee's evaluation
of interest to the audience.
Please prepare the proposal using the given guidelines and template
(See: https://www.coolchips.org/2023/call-for-contributions/).
Submission should be made through website:
https://easychair.org/conferences/?conf=coolchips26
---------------------------------------------------------------------------
Program Committee:
-Chairs:
Ryusuke Egawa (Tokyo Denki Univ.)
Yasutaka Wada (Meisei Univ.)
-Vice Chair:
Ryohei Kobayashi (Univ. of Tsukuba)
Ryuichi Sakamoto (Tokyo Tech.)
-Poster Chair:
Koji Hashimoto (Fukuoka Univ.)
-Special Session Chair:
Takatsugu Ono (Kyushu Univ.)
-Members:
Masaki Gondo (eSOL)
Koji Hashimoto (Fukuoka Univ.)
Teppei Hirotsu (NSITEXE)
Satoshi Imamura (Fujitsu)
Megumi Ito (IBM)
Yuetsu Kodama (Riken)
Hiroki Ohtsuji (Fujitsu)
MM Hafizur Rahman (King Faisal University)
Yukihiro Sasagawa (Socionext)
Shunsuke Sasaki (Toshiba Corporation)
Yuichiro Shibata (Nagasaki Univ.)
Kotaro Shimamura (Hitachi)
Jubee Tada (Yamagata Univ.)
Hiroyuki Takizawa (Tohoku Univ.)
Tomoaki Tsumura (Nagoya Institute of Tech.)
Toshiyuki Tsutsumi (Meiji Univ.)
Hayato Yamaki (UEC Tokyo)
Renyuan Zhang (NAIST)
---------------------------------------------------------------------------
--
Ryohei KOBAYASHI
University of Tsukuba
Center for Computational Sciences
E-mail: kobayashi at cs.tsukuba.ac.jp
（重複してお受け取りの際は何卒ご容赦下さい。)
お世話になっております．
筑波大学の小林 諒平です．
本MLをお借りして，COOL Chips 26 の論文募集についてご案内いたします．
IEEE Micro特集号およびIEICE英文誌小特集へのSelected Papers推薦等を
企画している他，"Cool Software"として，ソフトウェアおよびその開発に
関する投稿も広く募集しております．
HW・SW問わず，投稿をご検討いただけますと幸いです．
どうぞよろしくお願い申し上げます．
---------------------------------------------------------------------------
IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 26
Takeda Hall, The University of Tokyo, Tokyo, Japan
April 19 - 21, 2023
http://www.coolchips.org
CALL FOR CONTRIBUTIONS
---------------------------------------------------------------------------
* Submission site: https://easychair.org/conferences/?conf=coolchips26
* Author Schedule for Technical Papers:
- Feb. 10, 2023: Paper / Extended Abstract Submission (Web site)
- Mar. 17, 2023: Acceptance Notified (by e-mail)
- Mar. 31, 2023: Final Manuscript Submission
* Author Schedule for Posters:
- Mar. 24, 2023: Poster Abstract Submission (Web site)
- Mar. 27, 2023: Poster Acceptance Notified (by e-mail)
---------------------------------------------------------------------------
COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications.
The COOL Chips 26 is to be held in Tokyo on April 19-21, 2023,
and is targeted at the architecture, design and implementation of chips
with special emphasis on the areas listed below.
All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the IEEE Micro
(https://publications.computer.org/micro/) and the special section
in the IEICE Transactions on Electronics
(https://search.ieice.org/bin/index.php?category=C&lang=E).
Contributions are solicited in the following areas:
- *Low Power-High Performance Processors* for AI, IoT, Multimedia,
Digital Consumer Electronics, Mobile, Graphics, Encryption,
Robotics, Automotive, Networking, Medical, Healthcare, and
Biometrics.
- *Novel Architectures and Schemes* for Single Core, Multi/Many-Core,
NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.
- *Cool Software* including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low
Power Application Techniques.
Proposals should should be organized in a full paper format (6 pages)
or an extended abstract format (up to 3 pages) describing the topic
to be presented. If the proposal is a not-yet-announced product,
and you would like to keep the submission confidential,
please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee's evaluation
of interest to the audience.
Please prepare the proposal using the given guidelines and template
(See: https://www.coolchips.org/2023/call-for-contributions/).
Submission should be made through website:
https://easychair.org/conferences/?conf=coolchips26
---------------------------------------------------------------------------
Program Committee:
-Chairs:
Ryusuke Egawa (Tokyo Denki Univ.)
Yasutaka Wada (Meisei Univ.)
-Vice Chair:
Ryohei Kobayashi (Univ. of Tsukuba)
Ryuichi Sakamoto (Tokyo Tech.)
-Poster Chair:
Koji Hashimoto (Fukuoka Univ.)
-Special Session Chair:
Takatsugu Ono (Kyushu Univ.)
-Members:
Masaki Gondo (eSOL)
Koji Hashimoto (Fukuoka Univ.)
Teppei Hirotsu (NSITEXE)
Satoshi Imamura (Fujitsu)
Megumi Ito (IBM)
Yuetsu Kodama (Riken)
Hiroki Ohtsuji (Fujitsu)
MM Hafizur Rahman (King Faisal University)
Yukihiro Sasagawa (Socionext)
Shunsuke Sasaki (Toshiba Corporation)
Yuichiro Shibata (Nagasaki Univ.)
Kotaro Shimamura (Hitachi)
Jubee Tada (Yamagata Univ.)
Hiroyuki Takizawa (Tohoku Univ.)
Tomoaki Tsumura (Nagoya Institute of Tech.)
Toshiyuki Tsutsumi (Meiji Univ.)
Hayato Yamaki (UEC Tokyo)
Renyuan Zhang (NAIST)
---------------------------------------------------------------------------
--
Ryohei KOBAYASHI
University of Tsukuba
Center for Computational Sciences
E-mail: kobayashi at cs.tsukuba.ac.jp
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