COOL Chips 29 - Call for Contributions

[Ryuichi Sakamoto]

SWoPP MLの皆様
（重複してお受け取りの際は何卒ご容赦下さい。)

お世話になっております。

東京科学大学の坂本です。

本MLをお借りしてCOOL Chips 29の論文募集についてご案内いたします。

IEEE Micro特集号およびIEICE英文誌小特集へのSelected Papers推薦等を
企画している他、"Cool Software"として、ソフトウェアおよびその開発に
関する投稿も広く募集しております。
HW・SW問わず、投稿をご検討いただけますと幸いです。

COOL Chips 29では、IEEE Computer Society Technical Committee on 

Microprocessing and Microcomputersの厚意による支援のもと、会議に

参加する学生を対象にトラベルグラントを提供しています。これは、

学生が学会に積極的に参加できるよう支援することを目的とした制度です。

詳しくは、

https://www.coolchips.org/2026/cool-chips-28-travel-grants/

をご覧下さい。

よろしくお願い申し上げます。

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IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 29

Takeda Hall, The University of Tokyo, Tokyo, Japan

April 15 - 17, 2026
https://www.coolchips.org

CALL FOR CONTRIBUTIONS
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* Submission site: https://easychair.org/conferences/?conf=coolchips29

* Author Schedule for Technical Papers:
- February 6, 2026(JST): Paper / Extended Abstract Submission (Web site)
- March 13, 2026: Acceptance Notified (by e-mail)
- March 27, 2026 : Final Manuscript Submission

* Author Schedule for Posters:
- March 20, 2026: Poster Abstract Submission (Web site)
- March 23, 2026: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to 

present advancement of low-power and high-speed chips and systems. 

The symposium covers leading-edge technologies in all areas of 

microprocessors and their applications. 

The COOL Chips 29 is to be held in Tokyo on April 15-17, 2026, 

and is targeted at the architecture, design and implementation of 

chips and systems with special emphasis on the areas listed below. 

All papers are published online via IEEE Xplore. Especially, selected 

papers are encouraged to submit to the IEEE Micro and the special 

section in the IEICE Transactions on Electronics.

Contributions are solicited in the following areas: 

- Low Power-High Performance Processors and Systems for AI, IoT, 

Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, 

Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.

- Novel Architectures and Schemes for Single Core, Multi/Many-Core, 

NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, 

Dependable Computing, GALS and 3D Integration 

- Cool Software including - Parallel Schedulers, Embedded Real-time 

Operating System, Binary Translations, Compiler Issues and Low Power 

Application Techniques. 

Proposals should consist of a title, the name, job title, address, phone number 

and e-mail address of the presenter in a full paper format (6 pages) or an 

extended abstract format (up to 3 pages) describing the product or topic to be 

presented. The status of the product or topic should precisely be described. 

Proposals will be selected by the program committee’s evaluation of interest 

to the audience. Submission should be made through website. Detailed 

instructions are in author’s kit obtained from our Web-site

Please prepare the proposal using the given guidelines and template
(See: https://www.coolchips.org/2026/call-for-contributions/).

Submission should be made through website:
https://easychair.org/conferences/?conf=coolchips29


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Program Committee:
Chair

  Ryusuke Egawa (Tokyo Denki Univ.)
  Yasutaka Wada (Meiji Gakuin Univ.)
Vice Chairs

  Ryuichi Sakamoto (Science Tokyo)
  Thiem Van Chu (Science Tokyo)
Poster Chairs

  Koji Hashimoto (Fukuoka Univ.)
Special Session Chair 

  Jun Shiomi (Osaka Univ.)

Members

  Masaki Gondo (eSOL)
  Teppei Hirotsu (DENSO)
  Megumi Ito (IBM Research – Tokyo)
  Tatsuya Kaneko (Science Tokyo)
  Koyo Nitta (Univ. of Aizu)
  Naoya Niwa (Tokyo Univ. of Agriculture and Tech.)
  Tetsuya Odajima (Fujitsu)
  Hiroki Ohtsuji (Fujitsu Lab.)
  Yasunori Osana (Kumamoto Univ.)
  Hafizur Rahman (King Faisal Univ.)
  Masayuki Sato (Tohoku Univ.)
  Yuichiro Shibata (Nagasaki Univ.)
  Kotaro Shimamura (Hitachi)
  Jubee Tada (Yamagata Univ.)
  Hiroyuki Takizawa (Tohoku Univ.)
  Tomoaki Tsumura (Nagoya Institute of Tech.)
  Toshiyuki Tsutsumi (Meiji Univ.)
  Tomohiro Ueno (RIKEN)
  Hayato Yamaki (Univ. of Electro-Communications)
  Renyuan Zhang (NAIST)
  R. Yamano (Socionext)

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--
Ryuichi Sakamoto
Institute of Science Tokyo
E-mail: r-sakamoto at comp.isct.ac.jp