The prototyping facility can handle both flip-chip and wire-bond assemblyprocesses. It includes: a Speedline MPM 2000 screen printer, a Philips topaz Xchip-placement system, a BTU reflow oven for attaching passives, a GPD in-lineaqueous cleaner, a Datacon APM die-attach machine, K&S wire bonders, a FICOtransfer mold system, a K&S 7500 saw-singulation system, and a Lumonicslaser-mark system. For flip-chip assembly, the SiP prototype lab is adjacent toAmkor's Datacon flip-chip pilot line.