[INTERCON 2024] Last Call for Papers

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pshiguihara

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Jul 2, 2024, 2:36:29 PM (16 hours ago) Jul 2
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Dear all,

we hope this message finds you well. We are excited to announce the IEEE INTERCON 2024, which will be held from 06th to 08th November in Universidad San Ignacio de Loyola (USIL), Lima - Peru.

IMPORTANT DATES:

Paper submission deadline: June 2nd, 2024

Paper submission deadline: June 30th, 2024

Hard deadline paper submission: July 15th, 2024

Notification of Acceptance: September 4th, 2024

Camera-ready: October 4th, 2024

Author registration deadline: October 4th, 2024

SUBMISSION GUIDELINES

The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair:

https://easychair.org/my/conference?conf=2024ieeeintercon

The format of the papers is based on IEEE conference template, which can be downloaded from:

https://www.ieee.org/conferences/publishing/templates.html

TOPICS OF INTEREST

Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:

  • T1. Artificial Intelligence and Machine learning

  •  T2. Communications and Networking

  •  T3. Power, Energy, and Power Electronics

  •  T4. Biomedical Engineering and Healthcare Technologies

  •  T5. Robotics, Control, Instrumentation, and Automation

  •  T6. Multimedia Signal Processing and Analytics

  •  T7. Devices, Circuits, and Materials

  •  T8. RF Circuits, Systems, and Antennas

  •  T9. Data Science and Computing Technologies

  •  T10. Education in Engineering and Technology

ORGANIZING COMMITTEE

General Chair:
César A. Beltrán Castañón, IEEE Peru Section Chair

Technical Chair:
Nils Murrugarra, University of Weber, USA

Finance Chair:
Jimmy Túllume Salazar, IEEE Peru Section Chair


Publication Chair:
Pedro Shiguihara, Universidad San Ignacio de Loyola, Peru

José Durán, IEEE Peru Section Chair

Local Organizers:
Javier Morán, Universidad San Ignacio de Loyola, Peru
Juan Salazar, Universidad San Ignacio de Loyola, Peru

Anghello Rodríguez, Universidad San Ignacio de Loyola, Peru

Nain Ramos, Universidad San Ignacio de Loyola, Peru

Conference Contact:
Marleni Delgado

adminis...@ieee.org.pe

Advisory Committee:
Carlos Silva Cárdenas
Ernesto Cuadros Vargas
William Ipanaqué Alama

https://intercon.org.pe/


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