Solder Preform World – Not New Technology but Very Interesting Option Charity Webinar

3 views
Skip to first unread message

Bob Willis

unread,
Jun 3, 2020, 8:44:32 AM6/3/20
to SMTA-e-link

Solder Preform World – Not New Technology but Very Interesting Option Charity Webinar

24th June 2.30pm UK Time

 

All webinar times shown are UK time – to check your local time in your countries  https://www.timeanddate.com/worldclock/converter.html

 

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities

Mind – Better Mental Health  https://www.mind.org.uk/donate

Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie 


Webinar introduction

preform02.jpg


Solder preforms are normally solid solder shapes specifically designed to make one or multiple solder joints in one reflow operation. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings. Now preforms are incredibly engineered options which are as wide as your imagination

 

Preforms provide a defined volume of solder to form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms

 

Back in the day the presenter used preforms with vapour phase and hot air guns for feed through capacitors, wire wrap back planes, heat shields and cable forms. Welcome to the interesting and creative world of solder preforms

 

To Book Your Place https://attendee.gotowebinar.com/register/8696232484957655309


preform03.jpg


Our first preform webinar includes:

 

Soldering Applications

Solder alloys

Preform types

Fluxing options

Preform packaging

Soldering and temperature profiling

Reducing void formation

Traditional soldering, wire connections, die mounting & more

Inspection and process defects

 

Presented by Bob Willis and special guest Graham Wilson of Indium Corporation  

 

The webinar will run between 60-90min with a question and answer session. If you have a specific problem or failure, then please send your photos and examples in advance of the webinar. The webinars are limited so book your place early. A copy of each of the slides presented will be provided after the webinar in pdf

 

In preparation for the event and to ensure you are equipped to get the maximum benefit from our event, please read our simple Webinar Guideline

Reply all
Reply to author
Forward
0 new messages