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Underfill Epoxies

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Mike Fitzsimmons

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Jan 30, 1998, 3:00:00 AM1/30/98
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Hello,

I'm interested in any information on underfill epoxies that would be
suitable for use with some or all of the following conditions:

Cure temp below the 156C melting point of Indium
Thermal Coefficient of Expansion near that of Indium, 25ppm/Kelvin
Usable down to 50 Kelvin after curing
Low stress during cure - therefore a "filled" epoxy would help.
Thermal conductivity is desireable - therefore "filled" epoxy may be
bad.
Flows well through as little as an 8 micron gap between chips - again,
"filled" epoxies may not work.
Decent strength, adhesion, resistivity, etc. are desireable as well, of
course.


I'm eager to know what your favorite underfill epoxy is, if you have
one, regardless of whether you know about all the properties I listed.
I realize that no material will have everything we need, but perhaps a
thread on epoxy might benefit alot of other people!

Vendors are welcome to comment.

Thanks,
--
Mike Fitzsimmons (818)354-4304 FAX:(818)393-0045 mi...@jpl.nasa.gov
Jet Propulsion Laboratory
4800 Oak Grove Dr. M/S 300-315
Pasadena, CA. 91109-8099
Disclaimer: *NOT* the official opinions of JPL as an organization.
http://techreports.jpl.nasa.gov/jpl/ecomm/internet/gfec.htm#MESSAGE

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