On Sat, 19 Jan 2013 15:04:58 -0800, John Larkin
<jjla...@highNOTlandTHIStechnologyPART.com> wrote:
>>According to this article:
>><
http://iopscience.iop.org/0022-3735/9/12/029>
>>the magic recipe is 85% lead and 15% tin.
>That's low EMF against copper.
The effectiveness depends on the physical characteristics of whatever
he's soldering. If there's no temperature difference across the
copper to solder boundary, there should be no thermocouple effect.
Googling, I find that the recommended solder mix is 70% cadmium and
30% tin. Impossible to find today and rather dangerous. It also
bring back an old nightmare. I would get a roll of the stuff with
rebuild kits for bolometer RF power sensors. Lots of dire warning
attached to the roll of solder.
When one of the engineering techs tested high positive for cadmium
poisoning, the company had everyone involved get a blood test for
heavy metal poisoning as well as cadmium. My cadmium and lead levels
were rather high but not excessive. At the time, I thought I had
caught a cold or flu that would not go away. It turned out that it
had something to do with my handling and testing NiCd batteries and
possibly the cadmium loaded repair solder. Not much could be done
except to take zinc supplements and avoid further exposure. It took
about 6 months to shake the cold. In the meantime, I discovered that
crimping the bolometer leads with a brass ferrule produced less
temperature related issues than with the cadmium solder. Anyway, I
strongly recommend NOT using the Cd70/Sn30 solder mix.