They do normally test the first silicon of each new chip design for both
ESD robustness and also latchup.
As for catching it at the simulation stage, a big part of the problem is
that the spice models are fitted against measurements so that they match
the measured characteristics very well, but the measurements are usually
only done within a range of "reasonable" voltages and currents,
certainly not up to 1kV. The device models do not necessarily behave
like the real devices under ESD conditions, and the designers know this.
Therefore they often get their ESD cells from a corporate "ESD group"
who are supposed to know all about this stuff somehow - perhaps by some
experiments. From the circuit designer's point of view, as long as they
have used the corporate standard cell they would be mostly off the hook
in the event of reliability problems due to ESD. Sometimes the standard
ESD cells limit performance too much (capacitance etc.) and the circuit
designer will have to do their own ones, in which case they would take
much more interest in the actual robustness, and probably do a lot of
extra testing on the first silicon.
Also substrate currents from the ESD diodes can be collected by placing
a thick wall of grounded substrate contacts around the ESD cell.
Potential latchup candidates can be kept away from ESD diodes. (e.g.
grounded n-well capacitors close to a vertical NPN with its base biased
positively is a PNPN SCR structure, as are most CMOS logic gates.) Some
designers know about these things, but sometimes management dictates
that the designer can't do their own layout and a layout engineer is
responsible for that. Often the people doing the layout don't know any
electronics but they may or may not have been given rules that may help
to prevent latchup hazards. When debugging a chip on a probe station, it
is usually easy to trigger any latchup hazards using a pulsed laser
(which is often fitted to the microscope because it is used for cutting
tracks etc.). If the laser is de-focussed (to prevent cutting anything)
and then fired at a part of the chip, it will inject carriers and
trigger any latchup hazards in that region. By going around a chip
looking for these, I was able to fix most of them one by one such that
eventually it was much harder to latch up the chip. I don't think it is
normally something people bother with, provided the chip passes the test
where they try to latch it up by injecting currents into the external pins.