"Martin Riddle" <
marti...@verizon.net> wrote in message
news:ureps81dmsmg5do8b...@4ax.com...
Non RoHS Notes that I include...
Notes:
1. MATERIAL 0.062 THICK, EPOXY GLASS FR-4, 1OZ. COPPER CLAD
BOTH SIDES BEFORE PLATING.
2. FRONT TO BACK REGISTRATION TO BE WITHIN 0.0025".
3. HOLES NOT DIMENSIONALLY LOCATED SHALL BE WITHIN 0.005"
OF THE POSITION AS LOCATED ON THE MASTER DRAWING.
4. UNLESS OTHERWISE SPECIFIED ALL HOLES SHALL BE PLATED-THRU
HOLE DIAMETER TOLERANCES APPLY AFTER PLATING.
5. ELECTROPLATED COPPER SHALL BE USED FOR THE PLATED-THRU
HOLES, AND SHALL HAVE A MIN. THICKNESS OF 0.001" ON THE
HOLE WALLS.
6. ALL EXPOSED CONDUCTIVE SURFACES ON LAYERS 1 AND 4
INCLUDING PLATED-THRU HOLES, SHALL HAVE AN ELECTROPLATED
SOLDER COAT WITH A MIN. THICKNESS OF 0.0003". THE SOLDER COAT
SHALL CONTAIN A MIN. OF 60% TIN.
7. WHERE APPLICABLE, EDGE FINGERS ARE TO BE GOLD PLATED
.00005" MIN. OVER NICKEL .00020" MIN. (TO DIMENSION SHOWN)
8. BOARDS SHALL BE SOLDER MASKED ON LAYER 1 AND 4 OVER BARE
COPPER CONDUCTORS. THE SOLDER MASK SHALL BE GREEN SOLDER
RESIST LIQUID PHOTO-IMAGEABLE, MATTE FINISH.
9. SOLDER MASK SHALL BE APPLIED PRIOR TO SCREENING.
10. SCREEN ALL LEGENDS IN WORNOW INK 50-100, GLOSS WHITE.
11. BOARD MUST BE ETCHED IN COPPER ON SOLDER SIDE WITH MANUFACTURER
NAME, INITIALS OR LOGO, UL RECOGNITION MARK AND FLAME RATING
IN LOCATION SHOWN.