The backplane boards arrived and looking good, though not built and tested yet. I ordered 5 and received 8.
These are six layer boards from allpcb at 150*100 mm for $1 for 5, introductory offer. The stack up used was Ground, Signal (a) and power, Ground, Signal (b) and power, Ground, Signal (c) and power. I requested they use their alternate stack up of approx 0.2 mm prepreg and 0.4mm core to try to increase transmission line impedance, but as I used 8mil traces the estimated impedance is less than 50 ohm for rows a and b. I reduced the annular ring of pads on internal and top layer to 10mil, though this might be reduced further. Pads with no connection on inner layers can possibly be removed but then I would need to stop the ground fill from creating a short to ground and I was impatient to submit this.
Traces on each layer are arranged to connect each pad at 45 degrees and flow through to 45 degrees on the opposite side, with ground fill between signals on each signal plane.
Spacing of connectors on 15mm centres to match the 150x100mm pcb offer and the extruded aluminium rails that I plan to use.
Power to be supplied from one of the modules or from a separate front panel pcb.
This is an entirely passive backplane with vcc on pin 1 of every row and ground on pin 32 of every row. No daisy chain set up and none of the pins from 2 to 31 are committed. There is an extra row of ground pins at each end to allow for experimenting with bus termination and an additional b and c row at the left edge to allow a right angled plug to extend to another backplane, but the 15mm space between connectors will not be maintained. This might be used instead for a front panel on the rear of the chassis.
I’m planning to use 64 way a+b connectors, but included row c on the top signal layer for future experiments.
I’ll probably add 0.1uF smt capacitors between vcc and ground at pin 1 of each connector and also the same on each module.
I might have a problem driving the low impedance, though I do plan to buffer signals to the bus.
