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March 9, 2015
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Circulation Over 35,000
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Semiconductor
Grade Fluxes for Copper Pillar Flip-Chip
As the semiconductor assembly industry continues its movement toward finer pitch, combined with reduced copper pillar height, cleaning processes are increasingly difficult.
In response, this paper discusses the benefits of using semiconductor-grade ultra-low residue no-clean fluxes.
Indium Corporation
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What does a vexillogist study?
See answer below.
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Online
Auction: Former Assets of HEI Inc.
SMT/LED Component Package & Assembly Equipment, Test & Measurement & More! Bidding Starts Closing, Thursday, March 26, 9:00am CST. Assets located in Victoria, MN, Click for
more information...
Biditup
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How
to Deal with Resonances in Wirebonding
Resonance effects can impede or prevent wire bond formation. The major kinds of resonance are discussed: sharp resonances on eigenfrequencies and passive, following resonances.
Changing the ultrasonic frequency removes the true resonance while the passive resonance is independent of the US frequency....
F&K Delvotec
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Cartoon of the Day
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"If you pay your invoice on time, it will mess up our accounting system, so it's better if you keep paying late."
Copyright © Randy Glasbergen
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Full Steam Ahead For IoT
Criticism is rampant about the Internet of Things being partially baked, ill-defined, or just a rehash of old ideas that never got off the drawing board. While there is some
basis for that criticism, it really doesn't seem to matter. The semiconductor industry is in full pursuit of what many perceive ...
Semiconductor Engineering
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Advanced
Packaging Challenges Stress Free
Decades of microelectronics & advanced packaging expertise to accelerate your time-to-market. New product services from concept through onshore production. Design, characterization
& process development leads to secure onshore manufacturing for medical & bio-science, semiconductor and defense. Learn more...
Promex Industries, Inc
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Pac
Tech's LAPLACE - Cantilever
High accuracy automatic laser bonder for cantilever attach on probe card. Ultra-fine pitch 3D placement with accuracy ±3µm. Low stress laser bonding for probe card sizes up
to 13" with optional rework capability. Learn more ...
PacTech
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High
Capability Die Attach Film for Small Die Applications
Die attach pastes often can't facilitate the emerging requirements of small die packages. Find out how new non-conductive die attach films are enabling production and reliability
of these devices. Read more...
Henkel Electronics, LLC
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Private Equity Finally Digs Out of Troubled Freescale Chip Deal
As public investors cheer the biggest semiconductor deal since 2006, the world's largest private equity firms are breathing a sigh of relief. NXP's acquisition ...
Bloomberg
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Self-driving cars could generate billions in revenue
Self-driving cars could generate billions of dollars a year in revenue from mobile internet services and products, even if occupants spend only a fraction ...
Reuters
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One-on-One: Steven Woo
Semiconductor Engineering sat down with Steven Woo, vice president and distinguished inventor at Rambus, to talk about the IoT and where the real ...
Semiconductor Engineering
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Intel Calls for 3D IC
Intel is right: heterogeneous integration enabled by 3D IC "increasingly important part of scaling." At the recent ISSCC Intel presented the following ...
EE Times
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Semicon
China 2015
SEMICON China, March 17-19, Shanghai, China Attend the Advanced Packaging Forum at SEMICON China, where industry elites discuss packaging trends, technologies, and solutions
for the era of the mobile Internet. SEMICON China is the semiconductor industry's largest event, covering the complete IC manufacturing supply chain.
SEMI
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Calendar
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Mar 16, 2015 - Wafer Fab Processing Course
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Mar 16, 2015 - Overview of Semiconductor Manufacturing/ Dallas,TX
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Apr 13, 2015 - Overview of Semiconductor Manufacturing/ Albany, NY
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Apr 13, 2015 - Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
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Apr 14, 2015 - Wire Bonding Certification
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Apr 17, 2015 - Packaging and Testing of Implanted Medical Devices
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Apr 20, 2015 - Overview of Semiconductor Manufacturing Hsinchu, Taiwan
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Today's Sponsor
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An
Amkor MEMS / Electronic Sensor Case Study
Amkor's MEMS & Sensor Electronic Test processes provide a direct impact to the bottom line, by recovering parts that would have normally been considered bad. Learn more...
Amkor Technology
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EZ-FLO
High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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Automatic
R&D Die- Bonder
The T-6000 Die- Bonder is an all-purpose system for R&D, pilot and medium size production. It complements Tresky's product line perfectly - highly universal - modular - easy
to program. Die handling is standard from Waffle-Pack, Gel-Pack and up to 8" Wafers. Learn more...
Tresky
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"Science is always wrong. It never solves a problem without creating ten more."
George Bernard Shaw
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MVP
introduces Dual Lane AOI for Leadframe Inspection
Machine Vision Products announces the availability of dual lane magazine handling on their 850 DWMS platform. MVP's own integral loaders and unloaders and the 850 DWMS are now
available with dual lane capability. Learn more...
Machine Vision Products, Inc.
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What does a vexillogist study?
Answer: Flags
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