Dear Colleague,
We would like to invite you to submit an abstract for a Minisymposium on “Computational Mechanics for Free and Moving Boundaries (MS302) at the 17th World Congress on Computational Mechanics that will be held on July 19 – 24th, 2026, in Munich, Germany. In this Minisymposium, we will be examining theory, formulation, analysis, and applications for fluid/solid mechanics dominated moving boundary problems such as extrusion, coatings, mold filling, solidification/melting, evaporation, hydrogel swelling, drying, and droplet formation, etc. We especially encourage papers on manufacturing flows and free surface flows with non-Newtonian rheology. This Minisymposium will be a forum for highlighting advances in computational methods for moving boundary problems and will allow cross-fertilization between separate, but related disciplines.
Many exciting sessions are planned at the conference around the themes of manufacturing flows, energy systems, and biofluid dynamics. We encourage you to look at the conference website for details of this and other Minisymposia (WCCM-ECCOMAS2026).
If you are interested in participating, please submit an abstract via the conference web site by January 15th, 2025. The only requirement for the conference is an abstract that will be included in the conference proceedings. You can download the template from the conference website.
We encourage you to forward this information to others who may be interested, and we hope to see you in Munich.
Best Regards,
Rekha Rao, Sandia National Laboratories, rr...@sandia.gov
David Noble, Sandia National Laboratories, drn...@sandia.gov
Alec Kucala, Sandia National Laboratories, aku...@sandia.gov
Patrick Anderson, Eindhoven University of Technology, p.d.an...@tue.nl
Laura Battaglia, CIMEC, lbatt...@santafe-conicet.gov.ar
Marcela Cruchaga, Universidad de Santiago de Chile, marcela....@usach.cl
Lucy Zhang, Rensselaer Polytechnic Institute, zhan...@rpi.edu