[2nd Announcement and C4P] 4th Sino MOS-AK Workshop, Chengdu (CN) June 20-22, 2019

[wladek]

Arbeitskreis Modellierung von Systemen und Parameterextraktion 

Modeling of Systems and Parameter Extraction Working Group

4th Sino MOS-AK Workshop

Chengdu, China June 20-22, 2019

Together with local UESTC organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to consecutive, 4th Sino MOS-AK Workshop which will be organized at University of Electronic Science and Technology of China (电子科技大学) Chengdu, China between June 20-22, 2019 .

The MOS-AK Workshop in Chengdu, China, is dedicated to advanced electronic and photonic devices. MOS-AK Modeling Association has more than 20 years history of enabling compact/SPICE modeling R&D exchange, please refer to MOS-AK website. With the aggressive scaling of CMOS technologies and constantly emerging diversified devices, accurate device modeling technique poses severe challenge to circuit and system designers, in particular for RF/MW/mmW/THz/optics. With this background, the workshop aims to strengthen a network and discussion forum among experts in the field, provide a forum for the presentation and discussion of the leading edge research and development results of Compact Modeling, Characterization and Simulation techniques for advanced devices, circuits and technologies. Modeling and validation technique of all solid-state devices, including, Si, III-V, power, nanoscale electronic structures and other related new devices are within the scope of the conference. The forefront theme of MOS-AK is “Bridge of Process Technology and Integrated Circuits & Systems Design”. 

The MOS-AK Workshop will be held between June 21-22, 2019 at University of Electronic Science and Technology of China (UESTC) in Chengdu, China. The main goal is to exchange compact modeling (CM) related know-how and promote modeling technique to support semiconductor industry. In addition to oral presentations, distinguished experts in the modeling field will be invited to deliver keynote speeches on significant trends, advancements and applications in compact/SPICE modeling domain. On June 20, 2019 we also offer 1day training course related to "SiGe HBTs for mm-Wave Systems Applications” held by Dr. Andreas Pawlak and Dr. Wojciech Debski. In addition, a national students design competition based on GaN HEMT on Si process (OMMIC GaN D01GH) will be also announced. Winners, either single person or team will be awarded with free tapeout, bonus & issued certificate supported by Yifeng-UESTC. 

We welcome industrial partners to show their latest equipment, tools and all other related to the compact/SPICE modeling. After workshop, extremely excellent papers will be selected and recommended for publication in the renowned Journal such as Weily’s International Journal of Numerical Modelling: Electronic Networks, Devices and Fields (SCI Index) or International Journal of High Speed Electronics and Systems (EI Index).

Venue:

University of Electronic Science and Technology of China

电子科技大学

Chengdu, China

Important Dates:

Call for Papers - Dec. 2018

2nd Announcement - March 2019

Final Workshop Program - May 2019

MOS-AK Workshop: June 20-22, 2019

Paper Submission deadline: May 20, 2019 (Monday) 

Submission address: yy...@std.uestc.edu.cn

Notification of Acceptance:  June 3, 2019 (Monday)

Submission of final manuscript: June 10, 2019 (Monday)

Online Registration (to be open in Apr.2019 any related enquiries can be sent to Workshop Secretary: Yuan Yao (Mobile:13086679508))

On the behalf of the Organizing Committee:

Yuhang Xu, UESTC 电子科技大学

Wladek Grabinski, MOS-AK  (EU)

International R&D Adviser :

Min Zhang, XMOD

Advisory Committee:

Yue Hao, Xidian University

Jose Pedro, T-MTT Editor

Yogesh Chauhan, T-ED Editor

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