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Nano micro material surface treatment, perforation, roughness

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bernado

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May 20, 2009, 12:10:28 AM5/20/09

Nano micro cluster material surface treatment, perforation, roughness
Electrostatic cluster perforation for LIP, RIP, low extinguished
cigarette, tipping, filter, packaging, plug-wrap, Kraft, cement sack,
bag, fine and other paper, silicon or other coatings, laminates,
porosity from 80 up to 2,500 ml/2cm2/min, from 20 down to 6 Gurley,
hole sizes from 0.050 up to 100 microns, hole densities from 80-260 h/
cm2, zone widths from 2.0-6.0mm, up to 16,000,000 holes per Second,
web speeds up to 500 m/min, web widths up to 2,000 mm. Patent grant
DE10328937.

Including Co2 carbon, slab, fiber, diode laser, other material or
surface treatment, as well for micromachining and nanotechnology, is
usually used depending on quality at fine, rotogravure or offset
printing, holographic or publishing, writing, magazine, media, news,
flexo, packaging, bonded fabrics, non-woven, filter, coffee, tea, bag,
sack, Kraft, food, fresh fruit, force, reinforce, tipping, cigarette,
plug wrap, fiber, tissues, toilet, decoration, wall, gift, watermark,
recycling, booklet, bible or other special paper, certain plastic
film, foil, coating, laminating, converting, extruding, Textile,
Polymer or most of that varied types. It combines aluminum, stainless,
steel, brass, copper, ceramic, solar, panel, Titanium.

It is also used especially for additionally treating materials when
aiming special characteristics by physical or regular process reasons
what cannot be achieved by other process technologies. Moving material
web base weights from 10 up 150 grams per square meters by thicknesses
5 up to 100 microns are possible to use. Including defect inspection,
process automation, moisture vapor transmission rate, abrasion
resistance of lamination, water proof, ventilated or breathable
fabrics.

Our state-of-the-art industrially approved, sophisticated, compact,
multi functional, optical online sensor scanning systems together or
without electrostatic laser perforation technology operates precise
and reliable 24/7, are integrate able into existing rewinding,
slitting, spooling, spreading, printing, labeling, complex production
lines or other machines and production processes as well. Also, they
can be used as completely independent micro surface-all-over or zone
perforation units. Fully new ranges of applications will be made
available total new products with special features and properties.

Strategic business partnership or alliance
Request of cooperation in production technology with special product
characteristics and markets, these may be e.g. machine manufactures,
power electronics, engineering or process focused companies.

Preferably in China, Mongolia, Indonesia, Malaysia, Thailand, India,
Pakistan, Laos, Burma, Vietnam, Libya, Algeria, South Africa, Norway,
Finland, Sweden, Nigeria, Iraq, Iran, North Korea, Israel, Mexico,
Brazil, Venezuela, Cuba, Argentina, Colombia, Ecuador, Chile, Asean,
Mercosur, Banco del Sur where excellent conditions are partly
available in industrial fields of electrostatic nano micro cluster
perforation and 100 other micro laser material treatments.

In tied cooperation with a Chinese laser manufactures we are able to
offer complete machine and production lines solutions with laser
cluster perforation, micro material treatment or other machines.
International quantity and quality levels for Asia prices.

Additional starting capital or financial support is not required, but
a functioning, fair cooperation and partnership for the acquisition of
new customers, use of new product design, characteristics and improved
turnover figures. We are glad to exchange specific information in case
of further interesting.

Patent references
http://www.wikipatents.com/gb/2149092.html
http://www.wikipatents.com/de/3332886.html
http://www.wikipatents.com/de/2918283.html
http://www.freepatentsonline.com/EP0460369.html
http://www.freepatentsonline.com/7224447.html
http://v3.espacenet.com/publicationDetails/biblio?CC=EP&NR=0460369&KC=&FT=E
https://www.patent-net.de/index.php?content=projekt&id=163
https://www.patent-net.de/index.php?content=projekt&id=213
https://www.patent-net.de/index.php?content=projekt&id=155
https://www.patent-net.de/index.php?content=projekt&id=156
https://www.patent-net.de/index.php?content=projekt&id=214
https://www.patent-net.de/index.php?content=projekt&id=157
https://www.patent-net.de/index.php?content=projekt&id=158

IPM International Perforation Management
high-tech engineering – China – Germany - Thailand
Mr. Werner Grosse
tel./fax: 0049-3212-5375175
http://www.microperforation.com
http://www.microperforation.com.cn
http://www.deguodaguan.com/ipm/

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