Fwd: Webinar Still On-Demand: Bluetooth(R) Mesh - State-of-the-art Mesh Technology in Silicon and Software

[Tomasz CEDRO]

Zachecam do wysluchania i obejrzenia seminarium online bardzo ladnie wprowadzajacego do technologii Bluetooth Mesh na przykladzie ukladu firmy TOSHIBA z procesorem ARM Cortex-M0.. seminarium po angielsku :-)

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From: Engineering360 Webinars
Date: Tue, Jan 30, 2018 at 7:01 PM
Subject: Webinar Still On-Demand: Bluetooth® Mesh - State-of-the-art Mesh Technology in Silicon and Software

View in your browser Bluetooth Mesh® — State-of-the-art Mesh Technology in Silicon and Software Webinar is Still On-Demand Enter Here! What to Expect Learn the fundaments of Bluetooth LE mesh Understand the benefits of Bluetooth LE mesh for various applications (not only lighting) Get to know the applications in which Bluetooth LE mesh is used Discover Toshiba's Bluetooth LE mesh capability (FW & SW) in conjunction with G2/G3 HW Learn about Toshiba Bluetooth LE solutions and get more insight in the technology. SPONSORED BY System Requirements To ensure successful access on the day of the webinar, test your system to see if it meets the system requirements. Trouble Accessing the Webinar Please copy and paste the URL below into your browser: http://event.on24.com/r.htm?e=1573926&s=1&k=F5E6299306401A810E2D22828589F5F3 Sound/Volume - Turn your speakers up to hear the audio. You will not need to dial in. Please send your questions and comments to: Webin...@ieeeglobalspec.com Sven Hegner, Chief Engineer Solution Marketing, Toshiba Electronics Europe GmbH About Toshiba Electronics Europe GmbH Toshiba Electronics Europe GmbH (TEE) is the European electronic components business of Toshiba Electronic Devices and Storage Corporation. TEE offers European consumers and businesses a wide variety of innovative hard disk drive (HDD) products plus semiconductor solutions for automotive, industrial, IoT, motion control, telecoms, networking, consumer and white goods applications. The company's broad portfolio encompasses integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors, ASICs, ASSPs and discrete devices ranging from diodes to logic ICs. Formed in 1973 in Neuss, Germany, TEE has headquarters in Düsseldorf, Germany, with branch offices in Germany, France, Italy, Spain, Sweden and the United Kingdom providing design, manufacturing, marketing and sales. Company president is Mr. Akira Morinaga. Forward Privacy Policy Contact Terms of Use Follow Us on Twitter Follow Us on Facebook © 2018 IEEE GlobalSpec. All rights reserved, 201 Fuller Road, Suite 202 Albany, NY, 12203-3621 - 800.261.2052. All other products, company names, or other marks appearing in this communication are the trademarks and property of their respective owners. No portion of this email may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of IEEE GlobalSpec. To ensure prompt delivery, add re...@email.engineering360.com to your safe senders list. Please do not reply to this e-mail, as we are unable to respond from this address. If you would like to contact us, please send an email to: Webin...@ieeeglobalspec.com If a friend forwarded this event and you would like to hear about future events, click here.

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CeDeROM, SQ7MHZ, http://www.tomek.cedro.info