Low Stress Punching as per ASME Sec VIII

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jignesh makwana

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Feb 18, 2012, 3:07:04 AM2/18/12
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Dear Sirs,
Plz. help me understanding the requireemnts of Low stress punching for ASME Sec VIII  jobs.
The section  of BPVC refers for the commercially available low stress punching.
Can you please explainn me about the same, its size of impression/ impression depth/radius??
 
Awaiting your prompt replies.
 
Thanks & Regards
 
Jignesh Makwana
 

SENTHILKUMAR SWAMINATHAN

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Feb 18, 2012, 4:04:23 AM2/18/12
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Low stress stamps alphabets or nos looks like dotted impression instead of line OR curve. Different Size of stamp commercially available.  
 
 
 
Regards,
S.SENTHILKUMAR
From: jignesh makwana <jkmak...@gmail.com>
To: material...@googlegroups.com
Sent: Saturday, 18 February 2012 9:07 AM
Subject: [MW:13731] Low Stress Punching as per ASME Sec VIII

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Dindo

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Feb 19, 2012, 12:00:01 PM2/19/12
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There are now available solid or what you are calling line low stress hard stamps, the edges of which are rounded instead of pointed.

jignesh makwana

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Feb 20, 2012, 12:26:11 AM2/20/12
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Dear Sirs,
Thanks for yuor reply.
 
But, the query is still pending.
I want to know the thresold limit of stress; for the definition of low & high stress punching.
Obviously, the stress intensity will be directly depend upon the depth of indentation/ impression (base redius).
Now, if one is using dotted punches, but if the stress intensity crosses the thresold limit of low stress, then although one has used dotted punch, it will not be called as low stres punch as it has crossed the thresold limit.
So, whatever the type of punch may be (dotted/rounded/pointed),
low stress or high stress punch depend on the depth of indentation/ impression (base redius).
As this is going to reduce your thickness by the amount equal to the depth of impression.
& will act as stress riser.
So, from this what i believe that there must be the imperical relation of stress intensity & depth of impression with base redius.
 
I hope that you have understtod the intrent of the query.
 
Requesting other experts to favour their valuable suggestions for the same.
 
Thanks in advance
 
Jignesh Mawkana

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