Thing-O-Matic Hackage

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Ed Nisley

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Jan 6, 2011, 9:12:06 AM1/6/11
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After several rounds of assembly / disassembly / tweaking / reassembly,
the mechanical bits of Thing-O-Matic 286 seem to be flying nicely in
formation. I made several changes to the stepper motor controller
boards, the extruder controller board, and the mechanics that should
improve overall reliability and eliminate many of the weird glitches and
random behavior that seem to plague the thing.

I'll be dumping the notes & photos to my blog over the next week or two,
with the first post up today:

http://softsolder.com

I'm doing this in bite-sized chunks and will appreciate any comments /
suggestions / critiques / improvements on each part. After my TOM
accumulates more power-on hours and you've kicked my notes around, I'll
write up a summary of whatever seems to be the consensus.

Still to do: Thermal Core measurement and tweakage...

--
Ed
http://softsolder.com


Andrew Plumb

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Jan 6, 2011, 10:18:00 AM1/6/11
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Hi Ed,

Looking forward to seeing what you've come up with!

Are the board-level changes fixes that can be done to existing boards and/or EAGLE source-level changes?

What have you selected as a thermal paste-type material to use between the power resistors and the heater core?

I've been considering tinning the underside of the housings with lead-free solder so it's not-air-filled at extrusion temperature.  Digikey carries some that melts at 227C (http://search.digikey.com/scripts/DkSearch/dksus.dll?Detail&name=473-1100-ND) which would make for easy reflow in-situ (just add power!) and would be solid at moderate distance from the interface (aka minimal mess).

Thoughts?

Andrew.

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Ed Nisley

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Jan 6, 2011, 11:54:33 AM1/6/11
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On Thu, 2011-01-06 at 10:18 -0500, Andrew Plumb wrote:
> fixes that can be done to existing boards

That's the ticket: they're all modifications I applied to the existing
boards. Indeed, I applied them *before* firing the thing up for the
first time. Most are fairly easily removed if you decide they're not for
you, albeit the boards will be scarred for life.

I've given the good folks at Makerbot a heads-up on most of these and
(assuming what I'm doing makes any / enough sense) they can do a far
better job than I of blending any changes into the next board revision.

> thermal paste-type material

I just stuck half a dozen thermocouples onto the instrumented Thermal
Core and started running the first measurement this morning. It'll take
a while to work through all that...

> tinning the underside of the housings with lead-free solder

That probably won't work well, simply because the resistors have an
anodized aluminum shell: tough to get solder stuck on that. I like the
idea, though. Perhaps carve a pocket on the bottom of the resistors and
cast some solder in place?

Good old JB Industro-Weld epoxy is rated to 500 F = 260 C, which should
barely suffice. The MSDS sheet says it's 10-20% iron filled, so it's
probably thermally conductive enough for the job; a thin layer of nearly
anything is a pretty good thermal conductor.

Numbers! We need numbers!

--
Ed
http://softsolder.com


Andrew Plumb

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Jan 6, 2011, 12:33:14 PM1/6/11
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On 2011-01-06, at 11:54 AM, Ed Nisley wrote:

On Thu, 2011-01-06 at 10:18 -0500, Andrew Plumb wrote:
fixes that can be done to existing boards

That's the ticket: they're all modifications I applied to the existing
boards. Indeed, I applied them *before* firing the thing up for the
first time. Most are fairly easily removed if you decide they're not for
you, albeit the boards will be scarred for life.
[deletia]

Excellent!  I'll exercise them on my Gen4 beater boards as you post them and see how many might be back-ported to Gen3 Cupcake electronics.

thermal paste-type material

I just stuck half a dozen thermocouples onto the instrumented Thermal
Core and started running the first measurement this morning. It'll take
a while to work through all that...

tinning the underside of the housings with lead-free solder

That probably won't work well, simply because the resistors have an
anodized aluminum shell: tough to get solder stuck on that. I like the
idea, though. Perhaps carve a pocket on the bottom of the resistors and
cast some solder in place?

It would at least stick to the heater core steel though; tin the area under the resistors.  Not permanently adhering to the Aluminum side would be an advantage for "field repair". ;-)

Good old JB Industro-Weld epoxy is rated to 500 F = 260 C, which should
barely suffice. The MSDS sheet says it's 10-20% iron filled, so it's
probably thermally conductive enough for the job; a thin layer of nearly
anything is a pretty good thermal conductor.

Another option with plenty of high-temperature margin might be Omega's OB-700: http://www.omega.com/pptst/OB_BOND_CHEM_SET.html

It's the one they recommend for metals with high(er) coeffs of expansion.  Not sure how it will perform between metals of dissimilar coeffs of expansion though.

Numbers! We need numbers!

If you aren't there already, I'd also recommend monitoring http://groups.google.com/group/replicatorg-dev for firmware and ReplicatorG UI development activity.

Andrew.

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Andrew Plumb

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Jan 7, 2011, 2:27:03 PM1/7/11
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Hey Ed,


I hadn't noticed that the DC driver was at the long end of the 12V trace. That explains a lot w.r.t. people noticing the DC motor slow whenever the HBP and/or extruder heater are active.

Rather than scrape up the board for the ground connection, I'm tempted to drill a couple of thru-holes.  One thru just after the ":" in "Docs:" and another between the "ma" in "makerbot".  That would beef up both layers of ground-plane in that area, not to mention strengthen the mechanical connection to board.

Thanks!

Ed Nisley

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Jan 7, 2011, 5:02:12 PM1/7/11
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On Fri, 2011-01-07 at 14:27 -0500, Andrew Plumb wrote:
> tempted to drill a couple of thru-holes

The reason for not doing that is that the MOSFET Source pins (all three
of 'em!) are on the top surface. The Drain has all those heatsink vias
to the bottom surface, but they're all on islands isolated from the
ground plane.

The only current you want in those additional ground pins comes from the
Source pins a few millimeters away, so the biggest fattest widest
connection to the ground plane is the way to go.

The next time I have the hood up, I'll probably lay a fatter wire across
the Source pin connections, too, but they're probably Good Enough as-is.

> the DC driver was at the long end of the 12V trace

That ought not be a problem after getting 11+ amps of heater current off
the board, although measuring the actual voltage drop to the motor
driver would be a Good Idea.

Let me know how it works out...

--
Ed
http://softsolder.com


hybot

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Jan 7, 2011, 5:58:08 PM1/7/11
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In the redistributed 12V MOSFET supplies hack, rather than installing angled pins from under the screw terminals, wouldn't it be easier to just strip the ends of the two yellow video power leads, tin them, and put them in the screw terminals directly?  Is this not as robust in some way?  Or is there connection in the screw terminal block I'm oblivious to?

I also like Andrew's idea of drilling thru-holes for the ground, if only because it's less likely I'd screw that up.

hybot

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Jan 7, 2011, 6:00:58 PM1/7/11
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Ignore the thru-hole comment, you responded to that before my browser refreshed with your post.

Ed Nisley

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Jan 7, 2011, 9:56:22 PM1/7/11
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On Fri, 2011-01-07 at 14:58 -0800, hybot wrote:
> connection in the screw terminal block I'm oblivious to?

Nope, cutting the trace isolates the +12 V terminal from the rest of the
board, so you could poke two wires in the same hole with no problem.

The only reason I used those pins was that they allowed a semi-permanent
power connection to the board that's independent of the heater wires.
Having to not only get the heater wires in the proper terminals, but
*also* doubling up the +12 V lines, seemed like I'd be able to get it
right almost all the time...

--
Ed
http://softsolder.com


hybot

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Jan 7, 2011, 10:46:45 PM1/7/11
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Thanks.  And by the way, thanks for the great instructions on your softsolder.com site.  Even though I botch about 50% of my electronics projects (from what I can tell, if I was an EE that'd be 80%), your posts are comprehensive enough to make me game for it.

Ed Nisley

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Jan 8, 2011, 7:06:56 AM1/8/11
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On Fri, 2011-01-07 at 19:46 -0800, hybot wrote:
> Even though I botch about 50% of my electronics projects

Well, I'll be writing about a few mistakes of my own... as soon as I
work through the humiliation. [grin]

--
Ed
http://softsolder.com


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