| Editor's Note |
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Taiwan Semiconductor Manufacturing Co. Ltd. says it will skip the 22-nm node and move directly from 28 nm to 20-nm "half node" process technology. The move appears to solidify TSMC's lead in the silicon foundry business. The foundry giant has also revealed additional details of its 20-nm CMOS process technology. Semiconductor editor Mark LaPedus is gathering more details at a TSMC technology conference.
Startups are the lifeblood of any industry, but they are especially critical in the dynamic high-tech sector. We present Version 10.0 of our closely watched "Silicon 60" list of emerging startups. VC editor Peter Clarke has again updated our authoritative list with 21 new companies focusing on a wide range of electronics technology. For details, go to our new Silicon 60 Web site.
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| Top Story |
Latest version of our 'Silicon 60' list includes 21 new startups
We introduce Version 10.0 of the authoritative "Silicon 60" list of emerging technology startups.
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| Semiconductor News |
TSMC skips 22 nm, rolls 20-nm process
Seeking to take the technology lead in the silicon foundry business, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is putting a new spin on its strategy: After the 28-nm node, it plans to skip the 22-nm ''full node'' and will move directly to the 20-nm ''half node.''
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ESC: Confab to host another round of Intel versus ARM
Intel and ARM have been squaring up to each other across the netbook and smartphone sectors for a couple of years now. The ARM-versus-Intel battle is set to continue on a number of fronts at the Embedded Systems Conference in Silicon Valley, coming up April 26 to 29, at the McEenery Convention Center in San Jose, California.
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Update: STATS produces 300-mm WLP
Singapore's STATS ChipPAC Ltd. has expanded its embedded wafer-level ball grid array (eWLB) technology to reconstituted 300-mm wafers.
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| Business News |
Entrepreneurs drive Silicon Valley toward Detroit 2.0
A handful of entrepreneurs hope to turn Silicon Valley into Detroit 2.0 by supplying key subsystems for next-generation electric and hybrid vehicles but they disagree about how the new market they see for electric and hybrid vehicles will emerge.
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Maxim to buy Teridian for $315 million
Moving into a new and emerging market, Maxim Integrated Products Inc. has entered into a definitive agreement to acquire Teridian Semiconductor Corp. for approximately $315 million in cash.
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New York gains grant for 'green jobs'
The College of Nanoscale Science and Engineering (CNSE) of the University at Albany, N.Y. has received a grant from the National Science Foundation (NSF).
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Elpida files suit against Best Buy, Infineon
In response to a complaint filed earlier this year, Japan's Elpida Memory Inc. has filed a suit against Infineon Technologies AG and Best Buy Co. Inc.
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| Design News |
Numonyx set to discuss potential PCM "showstopper"
A research team from flash memory company Numonyx is set to discuss current density in phase-change memory at the International Reliability Physics Symposium.
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Virage Logic launches 28nm IP suite at TSMC event
At the TSMC Technology Symposium in Silicon Valley this week Virage Logic announced a full suite of 28nm memory compilers and logic libraries based on TSMC's high-K metal gate process.
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| Technology News |
MIT harnesses virus to power up the hydrogen economy
By harnessing living viruses to mimic the way plants use photosynthesis, a team from the Massachusetts Institute of Technology claims to extract fuel more efficiently from water. The process could kick-start the vaunted "hydrogen economy."
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Plastic Logic, Merck to deploy novel organics
Chemicals giant Merck KGaA (Darmstadt, Germany) and Plastic Logic GmbH (Dresden, Germany), the developer of the Que e-reader, have announced plans to develop, test and commercialize novel lisicon-type organic semiconductors from Merck in Plastic Logic's displays.
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| ESC Silicon Valley |
ESC: Two attendees will win a 'CanSat' launch
The father of the "CanSat" project will describe the effort and select the winners of two free launches during ESC-Silicon Valley.
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ESC: S3 Graphics, Presagis ink deal
S3 Graphics Inc. has announced a partnership with Presagis Inc., a provider of commercial-off-the-shelf (COTS) modeling, simulation and embedded display graphics software.
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| Product News |
Microsoft's Kin marries smartphone, social nets
Microsoft debuted Kin, its long-rumored smartphone, a handset focused on social networking using Microsoft's Zune media player interface and cloud computing services as speculation mounted Google is preparing an Android-based tablet to compete with the Apple iPad.
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| ESC Silicon Valley 2010 |
| ESC Silicon Valley, the largest most complete technical conference/exhibition in North America where you can see, learn and get hands-on training on emerging embedded products and technologies. Attend and be part of the most valuable and efficient professional development you will experience all year.
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