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 Dylan McGrath is editor of the EE Times Newsletter, which brings you the latest semiconductor and design news.
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| Editor's Note |
| What if Apple bought ARM? The London Evening Standard newspaper reported that rumors are swirling that Apple is considering a takeover of the intellectual property giant, whose architecture powers all manner of electronic products. It seems downright ludicrous at first glance, and the official position here is that the odds of it happening are not much better than the odds of an ice cube surviving a summer in the desert sun of Palm Springs, Calif.
But still. What if Apple did buy ARM to gain more control over the ARM architecture and block competitors' access to the technology? Such a move would turn the electronics world on its head and likely face a host of legal challenges by ARM licensees, not to mention public outcry. But we know Steve Jobs is not afraid to play hardball.
To buy ARM, Apple would likely have to spend north of $8 billion. That's not chump change. Apple could afford it if the deal made sense. But ultimately it does not.
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| Top Story |
ARM stock rises on Apple takeover talk
London's financial district was full of rumors on Wednesday (April 21) that Apple is considering a takeover of processor intellectual property licensor ARM Holdings plc (Cambridge, England), according to the London Evening Standard newspaper.
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| Semiconductor News |
Marvell rolls MPU for systems, plugtop PCs
Propelling new and green applications, including its emerging ''plugtop PC'' effort, Marvell Technology Group Ltd. has rolled out a low-power application processor.
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Linear hires workers, mulls new U.S. fab
Amid strong demand for its products, Linear Technology Corp. is hiring fab workers and is mulling plans to build a new fab in the United States.
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Infineon, Fairchild agree common power MOSFET packaging
Infineon Technologies AG and Fairchild Semiconductor International Inc. have announced an agreement to create compatibility between their power MOSFET packages. Specifically the agreement covers the Infineon PowerStage 3x3 and Fairchild MLP 3x3 packages.
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ARM Virtual Conference
ARM Virtual Conference: March 25th, 2010
The next in the Virtual Conference series by EE Times, Designing with
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| Business News |
Chip makers beat analysts' expectations
In another signal that the semiconductor market recovery remains in full swing, chip makers Qualcomm, SanDisk and Intersil reported quarterly results that exceeded consensus analyst expectations.
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Happy days are here for fab tool biz
Happy days are here again for most fab tool vendors--based on the results from ATMI, Lam, MKS, Novellus and others.
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Adobe throwing in the towel on Flash for iPhone
After years of working to get Apple's iPhone to support Flash software, Adobe Systems has thrown in the towel, according to a blog posting by an Adobe executive.
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CIA invests in LensVector
LensVector Inc. has announced a strategic investment and development agreement with In-Q-Tel, the venture capital arm of the U.S. Central Intelligence Agency (CIA).
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Hynix reports record sales
South Korea's Hynix Semiconductor reported record first quarter sales of 2.82 trillion won (about $2.54 billion), up about 1 percent from 2.8 trillion won in the previous quarter and up 115 percent 1.3 trillion won in the first quarter of 2009.
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| Design News |
QuickLogic rolls low-power system block for mobile devices
Programmable logic vendor QuickLogic announced a new proven system block for its customer specific standard products (CSSPs) that the company said enables handheld mobile system developers to conserve energy through effective power management by shutting down the CPU and the CSSP between bursts of activity caused by peripheral devices.
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LTE mobile gateways break 100 Gb/s speeds
Ixia together with with Alcatel-Lucent announced the results of an LTE Evolved Packet Core (EPC) test that broke the 100 Gb/s barrier for mobile gateways.
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| Commentary |
Opinion: Why everyone loves Pistorio Pasquale
Pistorio Pasquale, the honorary chairman of STMicroelectronics, will be next week in San Jose, Calif., to receive the Life Time Achievement Award at the EE Times' Annual Creativity in Electronics (ACE) Awards ceremony.
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| ESC Silicon Valley |
ESC: Via rolls 64-bit MPUs for embedded apps
Taiwan's Via Technologies Inc. has rolled out the VIA Nano E-Series processor line, a family of x86-based, 64-bit devices for the embedded markets.
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ESC panel addresses 3-D GUI designs
A panel session at the Embedded Systems Conference will address the challenges of designinging graphical user interfaces for embedded applications.
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| Course: From FPGA to ASIC |
| There are two reasons for migrating from FPGAs to ASICs, and many more reasons why that migration could easily go astray. The Fundamentals of FPGA-to-ASIC conversion presents the principles and the tools available to do it right, including a real-world example using Altera's HardCopy ASICs.
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