On Jan 12, 2026, at 4:32 PM, Sergei Grichine <vital...@gmail.com> wrote:
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Nice.
At CES, I visited the Bosch booth. They were suggesting these new IMUs:
BMI088 - "High stability and low temperature drifts. Vibration
robustness. Closed-loop gyroscope."
BMI423 - "Extended measurement range (32g and 4000dps). Integrated
feature set for activity tracking, head movement, and UI
applications."
BMI563 - "Extended measurement range (32g and 4000dps). Vibration
robustness. Low noise."
Smart sensor: BHI360 - "Integrated sensor fusion software. Open programmable platform. Low power MCU."
https://www.bosch-sensortec.com/products/smart-sensor-systems/bhi360/
$5.56 for one, $4.22 @ for 100. Oddly, this one does not support i3c.
"The BHI360 belongs to the BHI family of highly integrated,
ultra-low power programmable smart sensor systems. The
BHI360 integrates the Fuser2 processor, which is based on the
32-Bit ARC™ EM4™ floating point RISC processor, an in-
tegrated Inertial Measurement Unit (6DoF IMU) and a powerful
Event-Driven Software Framework specifically designed
for signal data processing and comes with pre-installed sensor
fusion and other sensor data processing algorithms.
The BHI360 offers two secondary high speed master interfaces with
I2C and/or SPI capability, and up to 8 GPIOs which
can be configured in a flexible way (e.g. Chip Select or Interrupt
lines). In this way, the BHI360 can be used as a “Sensor
Hub” connected to external sensors and devices, such as magnetic
field sensors, pressure sensors and many more.
All sensor data from both integrated MEMS IMU and external sensors
can be efficiently integrated, synchronized and
processed by the integrated Fuser2.
The BHI360 is mainly intended to be used as coprocessor,
offloading the main CPU from any sensor data processing
related tasks, like sensor fusion, data batching, position
tracking, activity recognition and gesture detection with high
precision and low latency while significantly reducing the overall
system power consumption. When used as a copro-
cessor, the BHI360 supports a wide variety of host CPU devices,
ranging from a small MCU up to multicore application
processors. The BHI360 communicates with the Host CPU through its
primary high speed I2C or SPI interface."
Magnetometer: BMM350 - "Unique field shock recovery feature. High accuracy and ultra-low noise. Low power consumption."
The thing I am really excited about are the pressure sensors. More about those later.
One thing that is interesting about these is that they support several communication methods, including I2C, I3C, and SPI. They can be used with 4 wire daisy chain or even simple trees without termination at high speed supported by newer MCUs. I3C is the new method:
"I3C (Improved Inter-Integrated Circuit) is a high-speed, low-power, two-wire serial communication interface from the MIPI Alliance for connecting computer chips, acting as a successor to I²C, offering better performance, efficiency, and features like dynamic addressing, while maintaining backward compatibility for legacy I²C devices. It's used in mobile, IoT, and embedded systems for sensor integration and control, combining benefits of I²C and SPI interfaces for simpler, more flexible designs with faster data rates (up to 12.5 MHz SDR) and reduced pin counts. "
I will be looking for MCUs with i3c support from now on. Many sensors with 2 wires (plus power), simpler wiring, no addressing headaches, at high speed and high frequency sampling.
sdw
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Stephen D.
Williams
Founder: VolksDroid, Blue Scholar Foundation |