Afterchecking opinions on a few forums, it seems Illustrator is the preferred choice for package design. I've also freelanced in an agency specialized in package design and all their stuff was in Illustrator but after discussing, this seems to have been due to habit and the investment it would have required to switch everything to InDesign...
Some printers require files to be submitted in Illustrator format, so ultimately it will come down to vendor requirements. However, I think of Illustrator and Photoshop as tools to generate layout resources, and InDesign as the best way to efficiently assemble those resources. Illustrator is great for creating the die cut and score template as well as all of the vector-based assets, but it is weak in areas where InDesign excels. Unless your vendor states otherwise, there is no reason not to get the most out of both platforms.
Mostly Illustrator with Photoshop elements inside of it, as it is the most popular format to prepare for print.Illustrator and Photoshop are the program you want to use to create things in because they have the highest amount of support for pre-press.
Esko, which is the most popular pre-press software, creates it's plugins for Illustrator and Photoshop, not InDesign. If you're printing in bulk you're probably not using digital printing. If you're not using digital printing you're probably using Esko software. If you're using Esko software you need to use Illustrator and Photoshop for the Esko plugins to make sure you have proper trapping, color layering, color separation etc...
I've worked at as an in-house designer for a publisher with it's own very large press, as well as a designer and art director for larger agencies, creating work for international clients (coke, mcdonalds, lipton), and I think you are spot on in your assessment of the programs & their use.
My name is Gil, Designer and a print production guy for the last 25 yearI will sum it like that:Illustrator is printers choice because you have plugins and apps like ESKO or ORIGAMI or ENGView or IC3D (which works with Indesign as well)that handles the trapping and the proof process of a package.Illustrator has a cloud of fans because no one has been there before them.
Although there is no built-in preflight, no info about images and no way to find overset text without looking, the industry got used to it and "ESKO" is the Adobe of the Packaging industry.That said, Indesign produces PDFs just as weel, it plays better in the global market has it can be localised using Cat tools (translators can work with indesign files easily), it has all the preflight you can think of, it has better text tools and can easily generate data based packaging.
Why everyone is using photoshop? Illustrator or Indesign? Adobe is kind of a monopoly, especially in Israel where type is written from right to left - not all companies invest in supporting hebrew or arabic (hebrew is 8-15 million people, while arabic is almost a billion world wide)There for, for now, ESKO rules, Illustrator rulesbut Indesign is smarter, better tool. As a printer, you should get a print ready file. But because not every designer can supply a package ready for real printing, there are bunch of people that work in a package PrintHouse that "fixes" all the client mistakes. If a plugin like "ESKO" or IC3d which does work with Indesign, will grab more market share, I am sure that Indesign will become the main tool for Handling Package variation (not design).The designers will do what ever they need to do in order to create stunning design and then they will create the full package in Indesign including Localisation or data based design, and tools like IC3d will create samples and mockups and trapping and folding and all the stuff needed not to make mistakes in this packaging industry!
My family owns a very large wholesale printing company. They print offset, digital, die cut, UV coat, you think it, they do it. I'm pretty sure my blood smells like ink and is CMYK Positive. That is the question they get the most. And I have heard the same response over and over again. PDF, 300 dpi.Now, if you need help, the print shop will help you at an hourly fee. And they will probably work with any file since they know them all and will end up converting it to a PDF in the end anyway. Lastly, you may want to tell your students it's very important to run their designs through some sort of spelling check thing since my favorite game while running around the shop was "Find the typo's in this flyer". It happens soooo often. The prepress person checks the file but they don't check for spelling.When younger my brother was a world renowned graphic designer but he stopped designing because running the printing company required him 24/7 and made him more money. He uses Illustrator.
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he...@aps.org.
Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices. Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression. We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package. Analyzing the qubit environment reveals no spurious modes up to 11 GHz. The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350μs. The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.
Quantum computers hold the promise to solve specific computational problems significantly faster than contemporary devices. Solid-state qubits that rely on microwave control to operate are among the leading candidates for realizing useful near-term quantum processors, but significant engineering challenges constrain these devices from scaling up further. In particular, qubits require a precisely engineered microwave environment to suppress energy decay and corresponding information loss. For instance, the corruption of information can occur due to lossy package modes interacting with the qubit. As the number of qubits increases, qubit packages must be adapted to support an increasing number of control lines without creating additional loss channels.
This work provides an important step towards the implementation of larger, near-term quantum information processors and in understanding how to provide efficient control lines while maintaining high qubit coherence.
Package environment, layout, and requirements. (a) Dilution refrigerator with multiple temperature stages holding the qubit chip enclosed in a microwave package. The microwave package interfaced with through microwave lines is mounted on a cold finger in the mixing chamber reaching a base temperature of approximately 10 mK. (b) The microwave package consists of a metal enclosing, microwave connectors, an interposer for signal fan out, and a microwave cavity in the center surrounding the quantum chip. (c) The purpose of a microwave package is to shield the enclosed qubit chip from external radiation (red oscillating arrow) and stray magnetic fields (yellow lines) while providing impedance-matched (transmitted green pulse and reflected blue pulse at the input and output), low-crosstalk communication channels (crosstalk in green at input), and a thermal link to the dilution refrigerator.
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