Download Tuning Solution
Holli Slye
Once the license has expired, the software will continue to function but will use the basic algorithm to search for available solutions. For this it will be limited compared to the version with active license
ASUS has over 25 years of expertise in the server industry and has a dedicated team of engineers specializing in server hardware design, software and firmware integration, and performance tuning and optimization for a broad range of applications. The world-beating performance of ASUS server products underscores our commitment to pursuing continuous system optimization and performance tuning to deliver the highest-quality servers to customers.
This little device mounts to most 3+3 guitars using the existing nuts and washers of a pair of the tuning pegs on your guitar. So, for most people, no permanent modification is required. Once installed it straightens the strings through the nut and it routes them to the tuning pegs using little floating rollers. It is actually shocking how well it works, how easy it is to install, and how many decades it took for it to be invented and patented. I was so impressed by it that I actually started a company to import it into the US!
I had a question about the tuning on our 7800 ICP-MS. Recently, I have noticed the tune for 89 (and 7 slightly) is looking strange. I checked back to older tunes, and gradually it has gotten worse. I want to find out if this is something I can be preventative on/be worried about. And if so, what can I do to resolve any potential issues.
ZEISS ForTune and ZEISS ForTune EUV improve wafer intra-field litho parameters by mask tuning in high lateral resolution on top of any other available solution in the market and at low cost. The systems are available for all market segments (Memory, Logic in DUV and EUV) and cover the following applications:
Both, ForTune and ForTune EUV, are complimentary to the scanner. The RegC functionality converts wafer intra-field OPO contributions from non correctable to correctable errors by the scanner in high lateral resolution. By that the wafer OPO is improved on top the scanner knobs capabilities.
The Wafer On-Product Overlay (OPO) is another limiting key parameter for chip performance which needs to be well controlled. The main contributed parameters can be categorized as inter-field and intra-field parameters. Both can be controlled by the scanner. However, the scanner is limited in the intra-field overlay resolution and can control only up to the 3rd order polynomial across the slit. This scanner limitation leads to Non-Correctable Errors (NCE) in high orders that cause OPO is out of specification. ForTune converts NCE to CE (Correctable Errors) resulting in an improved intra-field contribution. This helps to reduce the Wafer On-Product Overlay for DUV as well as for EUV masks.
The KS-4 can remain in a project vehicle to monitor detonation or knock levels. Anytime the map needs to be adjusted the KS-Pro Knock Analyser Pro can be plugged directly into the KS-4 to monitor knock whilst the engine map is altered. This solution means that there is no need to remount the sensor each time or route cables into the engine bay. Simply plug the Knock Analyser Pro into the KS-4 and switch on.
I got real tired of SCT's stranglehold on Ford tuning and was super pumped when I found out the Subaru didn't require another stupid tuning device that costs as much as a laptop and ends up collecting dust 363 days a year.
"EcuTek is our solution so it's not a big deal, only sad part is the fact they they dropped this bombshell on us without any notices... EcuTek has the appropriate ROMS, open source is a hijacked version of EcuTek"
I did get a few shops tell me that we wouldn't continue a tuning conversation if I wasn't using an accessport but I think that was for proprietary reasons as it was back in 2016, long before this news was ever a thing.
G.G. and H.A.B. built the current version of the solution-shearing set-up. G.G. and E.V. performed X-ray and transistor measurements. S.C.B.M. performed unit cell and molecular packing calculations. G.G., E.V., S.C.B.M., D.H.K., M.F.T. and Z.B. analysed the X-ray data. S.A.-E. and A.A.-G. performed transfer integral calculations. G.G., E.V. and Z.B. wrote the manuscript, and all other authors had input. Z.B. and S.Y.L. directed the project.
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