PCB board production
arnol...@uonbi.ac.ke
I hope you have all been well. Receive greetings from Kenya. I really need
your help and references. We have a couple of smart fusion FPGA IC and we
need to make PCB boards for them. Does anybody know of a Chinese company
that can make up to 6 layer PCB boards or any other country that can
produce 6 layer circuit boards. Thank you.
Regards
Bett
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Cynthia Ama Ashong
From: "arnol...@uonbi.ac.ke" <arnol...@uonbi.ac.ke>
To: fpga...@googlegroups.com
Sent: Thursday, June 21, 2012 9:27 AM
Subject: [FPGA-VHDL] PCB board production
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Luciana De Micco
- Communications and protocols,
- Wireless communications,
- RTOS, FPGAs,
- HDLs and ASICs,
- Implementation of Embedded Systems,
- Embedded Linux,
- DSP,
- Embedded Software,
- Processor's architecture,
- Robotics and Bioengineering.
Luciana De Micco
Estimados,
Hasta el 10 de Abril de 2016 estará abierta la presentación de trabajos para el Congreso Argentino de Sistemas Embebidos (CASE2016).
El CASE se llevará a cabo dentro del ámbito del Simposio Argentino de Sistemas Embebidos (SASE) del 10 al 12 de Agosto de 2016 en la Facultad de Ingeniería, UBA.
Los temas de interés son:
- Protocolos y comunicaciones
- RTOS
- FPGAs HDLs y ASICs
- Implementación de Sistemas Embebidos
- Linux Embebido
- DSP
- Software embebido
- Arquitectura de procesadores
- Robótica
- Bioingeniería
Los trabajos pueden presentarse en tres categorías “Artículo”, “Foro tecnológico” y “Resumen”.
Todos los trabajos se publicarán en forma gratuita en el Libro de Memorias del Congreso (ISBN registrado) y en la página web del evento. Además, los trabajos aceptados en la categoría “Artículo” serán enviados para su publicación en IEEE Xplore y otras bases de indexación.
Más información en el pdf adjunto y en www.sase.com.ar/case/cfp.
Saludos cordiales,
Organización CASE2016
Luciana De Micco
Please help us distribute the last CFP for CASE2018
Deadline for paper submissions: May 18th, 2018
CASE2016: August 15th to 17th, 2018
Papers in the following areas (not limited to) will be accepted:
- Communications and protocols,
- Wireless communications,
- RTOS, FPGAs, HDLs and ASICs,
- Implementation of Embedded Systems,
- Embedded Linux,
- DSP,
- Embedded Software,
- Processor's architecture,
- Robotics
- Bioengineering.
SUBMISSIONS
Papers can be submitted in three categories "Regular paper", "Technical Forum" and "Abstract".
Participation in CASE2018 is free, and includes the publication of the work at the Proceedings of the Conference, with registered ISBN and on the website of the event, as in previous editions.
Regular Papers will be submitted for inclusion into IEEEXplore
(see http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=8114364) as well as other Abstracting and Indexing (A&I) databases, thus they must be written in English. Contributions in "Technical Forum" and "Abstract" categories can be written in English or Spanish.
All accepted papers will be presented during the poster session at CASE2018, and also distinguished contributions will be invited to make an oral presentation as part of SASE2018 Tutorials.
In order to be accepted the papers should enter in the scope of the conference, be an original work, the work should not have been presented elsewhere, the text should be clear, and consistent. Works will be received at the site (https://easychair.org/conferences/?conf=case2018), according to the conditions and format described at (http://www.sase.com.ar/formato-de-trabajos/).
This conference is subject to IEEE plagiarism standards, please read (http://www.ieee.org/publications_standards/publications/rights/plagiarism_FAQ.html)