Re: EMS 188A 001 WQ 2013: MMIC Shipment Received

[Thomas Lau]

Morning Mike,
I'm sad to hear that one of our assemblies didn't make it. The assemblies that we made were :
1. center sample. 60um NiAl foil with Cu Shim
2. Lower left sample. 60um NiAl foil with Mo Shim
3. Lower right sample. 60um NiAl foil with Cu Shim

Secondly, we will be leaving from Davis around 8-8:30 this Friday and we will probably arrive there no later than 10am. We don't know how long the tests take but we plan to stay there until the job gets done.
See you tomorrow,
Thomas Lau (Team Focett)

On Tue, May 14, 2013 at 8:03 AM, Michael Powers <mtpo...@ucdavis.edu> wrote:

Hi EMS 188 Project Teams,

I was able to track down the shipment and I have the materials in my possesion.  I received what appears to be a power supply and two sets of MMIC assemblies.  One carrier has a green post-it on the from and has 3 assys.  One did not make it, the chip came off the shim.  I'm not sure the other two can be used for thermal conductivity testing as the material is well over the edge of the shim.  I'll ask about that.  The other carrier has 5 assys.

Can you please tell me 1) what I have here (i.e. which ones are Sn plated and which ones are Au plated and what shim materials they are mounted on, in other words, a detailed explanation of what was sent) and 2) which ones are targeted for thermal conductivity testing so I can have them mounted and bonded up.  Are some of these on Mo shims and some on Cu?  If so, how can I tell them apart?

You can either send me an e-mail or we can talk about this at class tomorrow, but the clock is ticking.  To maximize the efficacy of your field trip on Friday, I should get the thermal conductivity assys mounted and bonded in advance.  The more time we have for that the better.

Finally, I have not heard back yet when you plan to arrive and how long you plan to stay.  I need to advise the engineers that are supporting this effort.

Best Regards,

Mike

[Thomas Lau]

Also, the chips we sent you should be all for thermal testing. We are bringing the other assemblies(dead) with us on Friday.
-Thomas Lau

[Francois Inshaw]

When was it decided we were leaving at 8:00 am. I do not remember that being talked about. 

Francois

Sent from my iPad

[Ted Yang]

removed Mike Powers, from this thread;

The decision was made since Mike's last email: "I suggest sometime between 10 am and noon"

There were multiple occasions in class and outside of class discussing the rental of the van and departure times; there was no formal agreement--but amongst the discussion of leaving times no opposition from anyone was brought up--thus the departure at 8AM.

[Ted Yang]

This was just not our group; it was discussed collectively as a whole class (whether everyone in the class actually inputted their opinion)--as the engineers/technicians at Agilent will be working with both groups at the same time.

As a commuter from Elk Grove every morning, I personally would not like to leave at 8--but it was decided to get work done early by the entire class.

On Tue, May 14, 2013 at 2:02 PM, Francois Inshaw <fgin...@ucdavis.edu> wrote:

I was not included in this discussion. In class I asked for us to leave at 10 so we would arrive at 12

Francois

Sent from my iPad

[Thomas Lau]

Also, they told us last meeting that the live chips were to be brought with us to Agilent on the day of arrival. It's better if we get there earlier and get things done. We will set this time tomorrow but I'm pretty sure 8am is the time we need to leave.
-Thomas Lau