The University recently signed a campus-wide agreement with Ansys. The agreement covers teaching and academic research use of a number of Ansys software products (including Lumerical and Zemax) that are now available to all College of Engineering faculty at no additional cost.
If you have questions about getting one of these titles installed on your university-owned computer, contact your departmental IT support staff. If you have questions about the campus-wide Ansys software agreement, please email [email protected].
PITTSBURGH, May 16, 2023 /PRNewswire/ -- Ansys, (NASDAQ: ANSS) the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive agreement to acquire Diakopto. A provider of differentiated EDA solutions to accelerate integrated circuit (IC) development, Diakopto focuses on helping resolve critical issues caused by layout parasitics. The transaction is subject to the satisfaction of customary closing conditions and is expected to close in the second quarter of 2023. It is not expected to have a material impact on Ansys' consolidated financial statements in 2023.
Diakopto develops products that address the growing complexities and unintended effects of designing ICs in the modern era. Semiconductor designs increasingly employ advanced process node technologies, where interconnect parasitic effects limit the performance, reliability, and functionality of designs. Diakopto's market-leading products have been adopted by dozens of customers, including tier-one semiconductor companies, for a broad range of applications.
"Diakopto's culture of strong engineering excellence and its innovative and highly differentiated products create a natural alignment with our organization. We are eager to welcome their team to the Ansys family," said Shane Emswiler, senior vice president of products at Ansys. "Incorporating Diakopto's unique methodology will support designers using Ansys to quickly and easily pinpoint the few elements, out of billions, causing bottlenecks. Designers can then optimize and debug designs more efficiently for enhanced IC performance and reliability, and accelerate time to market. The acquisition will complement Ansys' existing offerings for engineers at every level as Diakopto's intuitive and out-of-the-box experience doesn't require extensive training or complicated setups or configurations."
"Today's announcement brings together two like-minded companies on the forefront of innovation, and we are excited about becoming part of the Ansys family," said Maxim Ershov, CEO and CTO at Diakopto. "By joining forces with Ansys, we're confident that we can solve a broader set of problems in the chip design workflow together, strengthening offerings for our customers and driving more innovations in high-tech designs for data center, 5G, automotive, and mobile applications."
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. Diakopto and ParagonX are trademarks of Diakopto Inc. All other brand, product, service and feature names or trademarks are the property of their respective owners.
This information contains certain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 with respect to the acquisition, including statements regarding the benefits of the acquisition and the products and markets of each company. These forward-looking statements generally are identified by the words "believe," "project," "expect," "anticipate," "estimate," "intend," "future," "opportunity," "plan," "may," "should," "will," "would," and similar expressions. Forward-looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual future events to differ materially from the forward-looking statements including but not limited to: (i) the risk that the acquisition may not be completed in a timely manner or at all; (ii) the failure to satisfy the conditions to the consummation of the acquisition; (iii) risks that the proposed transaction disrupts current plans and operations of Diakopto and potential difficulties in Diakopto employee retention as a result of the transaction; (iv) the occurrence of any event, change or other circumstance that could give rise to the termination of the acquisition agreement; (v) risks related to diverting management's attention from Diakopto's ongoing business operations; (vi) the ability of Ansys to successfully integrate Diakopto's operations, product lines, and technology; (vii) the short- and longer-term effects of the COVID-19 pandemic; (viii) the ability of Ansys to implement its plans, forecasts, and other expectations with respect to Diakopto's business after the completion of the acquisition and realize additional opportunities for growth and innovation; and (ix) adverse changes in the economic and political conditions in the regions in which Ansys and Diakopto operate. In addition, please refer to the documents that Ansys files with the SEC on Forms 10-K, 10-Q and 8-K. These filings identify and address other important risks and uncertainties that could cause events and results to differ materially from those contained in the forward-looking statements set forth herein. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and Ansys assumes no obligation to update or revise these forward-looking statements, whether as a result of new information, future events, or otherwise.
Reliability Engineering Services (RES) delivers valuable insights to the electronics industry. From battery reliability, product design review to accelerated life testing our experts can solve your challenges.
3. Use of CLIENT SOFTWARE. You may use the Client Software installed on your Devices only in accordance with your agreement with Customer and the terms under this document, and only in connection with the Software Services, provided to you by Customer. The terms of this document permanently and irrevocably supersede the terms of any Microsoft End User License Agreement that may be presented in electronic form during the installation and/or use of the Client Software.
5. Copies. You may not make any copies of the Products; provided, however, that you may (a) make one copy of Client Software on your Device as expressly authorized by Customer; and (b) you may make copies of certain Redistribution Software in accordance with Paragraph 4 (Use of Redistribution Software). You must erase or destroy all such Client Software and/or Redistribution Software upon termination or cancellation of your agreement with Customer, upon notice from Customer or upon transfer of your Device to another person or entity, whichever occurs first. You may not copy any printed materials accompanying the Products.
6. Limitations on Reverse Engineering, Decompilation and Disassembly. You may not reverse engineer, decompile, or disassemble the Products, except and only to the extent that applicable law, notwithstanding this limitation, expressly permits such activity.
7. No Rental. You may not rent, lease, lend, pledge, or directly or indirectly transfer or distribute the Products to any third party, and may not permit any third party to have access to and/or use the functionality of the Products except for the sole purpose of accessing the functionality of the Products in the form of Software Services in accordance with the terms of this agreement and any agreement between you and Customer.
9. No Warranties, LIABILITIES OR REMEDIES BY MICROSOFT. Microsoft disclaims, to the extent permitted by applicable law, all warranties and liability for damages by Microsoft or its suppliers for any damages and remedies whether direct, indirect or consequential, arising from the Software Services. Any warranties and liabilities are provided solely by Customer and not by Microsoft, its affiliates or subsidiaries.
12. EXPORT RESTRICTIONS. The Products are subject to U.S. export jurisdiction. Customer must comply with all applicable laws including the U.S. Export Administration Regulations, the International Traffic in Arms Regulations, as well as end-user, end-use and destination restrictions issued by U.S. and other governments. For additional information, see
13. LIABILITY FOR BREACH. In addition to any liability you may have to Customer, you agree that you will also be legally responsible directly to Microsoft for any breach of these terms and conditions.
This is my first post, so any help would be appreciated. I downloaded and installed the student Spaceclaim 2023 R2. It works very well and allows me to save each file that I start. My planis to use it to create 3D geometry for 3D printing, or as a reverse-engineering software, which usually is based on some 3D scanned item, and importing the scan file into Spaceclaim, then building a model in the same space as the scan file. Good news, that all works perfectly.
Bad news, after creating new geometry, or reverse-engineering a scanned item, although I can save the file, I cannot export the new file in any format. My preferred choices would be stl and then step files. This is simply not an option on the student version of Spaceclaim. I tried 17 ways to Sunday.
c80f0f1006