Re: Mentor Graphics Pads 9.0 24
Tiesha Tyler
I am using an eMMC memory in one of my designs. It is in a 153 ball package (which appears to be one of two industry standard packages for this type of memory). The pads for the BGA balls have 0.33mm diameter (13.2 mils) and 0.5mm pitch. That leaves 0.17mm (6.8 mils) spacing between each pad.
To route traces between the pads spaced 6.8 mils apart would require like 2 mil traces with 2 mil spaces. We are using 1/2 oz copper thickness on the outer layer. I am not aware of any board houses that can reliably do 2 mil traces and spaces on 1/2 oz copper. Normally they won't go below 4 mil traces / 4 mil spaces. So, given that, we can't route between the balls.
If we can't route between the balls, the next option is drop vias-in-pad to do the breakout. Our board has like 18 layers, so its 100 mils thick. Typically, we wouldn't want vias smaller than 10 mils finished hole size on a 100 mil board. We prefer to make our boards IPC Class 3, but even if we relaxed it to IPC Class 2 we would still be looking at a 20 mil pad for a 10 mil via. But 20 mils is way larger than the 13.2-mil SMD pads, so that's out of the question. To make this work we could potentially increase the pad size by 2.8 mils (making them exactly 15 mil diameter with 4 mil spacing), and then use 6-mil vias with 15 mil pads. But doing 6-mil vias on a 100 mil thick board is usually not possible unless we are doing blind vias to layer 2 or 3 ( which is going to start increasing cost a lot).
Full 3D visualization of the PCB includes components, pads, traces, vias, planes, silkscreen, soldermask, etc. This photorealistic view allows accurate inspections of the board prior to manufacture so that you can check for problems in the design. 3D viewing also provides a direct view of the board's internal layer stackup, giving you all the information needed to design custom PCB knowledgeably and with confidence.
The new PADS release with PADS HyperLynx DC Drop and PADS FloTHERM XT electronic cooling options will be available in July. The PADS HyperLynx DC Drop tool starts at $4995 (USD). The PADS FloTHERM XT tool starts at US$12,500.To learn more, consult a Mentor Graphics sales representative or call 1-800-547-3000. Additional product information can be found at www.pads.com.
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Visit www.mentor.com.
Is there a way to connect several pads (PCB terminals) to one pin in the schematics?In my case I have a fuse holder consisting of 4 pads per fuse pin (See _Sheets/Littelfuse_ATO-PCB-Fuse-holders-178.6765.pdf) and I would like to avoid making a total of 8 pins in the schematics by"grouping"4 pads into one so I can use a 2 pin schematic symbol.Is it possible and how do I go about doing that??
I have memory library files from AMS. The files containt 3 directories are Synopsys, cadence and VHDL. I have to try import that file in VHDL directory and I import .vhd but this didn't work and need some packaged, so I need if anybody have solution for this problem?. possible to import synopsys or cadence file into ICStudio mentor graphics. thanks
So some context, I bought my 3090 when it came out and had no issues with it in the beginning. Great card. roughly 2 years later it started cooking the vram hitting the 110c point before shutting down. Thought it was a cooling pad problem so I sent it off to a company who switched out all the paste and pads. They told me that there was a bit problem with the memory but that it shouldnt effect me.
Accelerators can provide early-stage technology companies with capital, mentorship, business training, key services and exposure to qualified investors, which will increase the value of an enterprise and the likelihood of follow-on funding.
Tigerlabs in Princeton offers a six-month accelerator program for early-stage software companies across a broad array of sectors, including digital health, financial services, Internet of Things (IoT), advertising and media, education, and enterprise. Tigerlabs notes that, to date, it has invested in more than 40 companies that have raised a total of more than $40 million and have a collective valuation of over $120 million. Accelerator participants have access to appropriate and targeted mentorship from leading executives, entrepreneurs, and investors, direct access to decision makers at leading corporations, and shared office space in its expansive co-working facility. Tigerlabs provides $25,000 up front to participating companies, with up to $50,000 in additional matching capital. Applications are accepted on a rolling basis.
aa06259810