Well, maybe. Some of the USB flash sticks are double sided, and would
use double-IR reflow, with water soluble flux (used with the new solders).
The flux is washed off after the soldering steps. (Gone are the days when
the washing machine was filled with trike, and the fluid was filthy and
left a film.) I worked early enough in the industry, to receive boards
that were improperly washed with the old solvent.
I worked early enough, to see our own blank PCB manufacturing facility.
With tanks of vile dark fluids (etchant and plate-up), the press for
laminating the boards, and so on. Later, all that work was farmed out,
and the PCB plant removed. The plant for that was poorly lit, and it
looked like a medieval torture chamber of some sort.
*******
The USB connector would be a different matter, as some of those
are thru-hole. So the entire manufacturing process may require
three steps. With the USB keys done in large sheets, and sawed
up afterwards. You could not run a item like that through a
standard manufacturing line, because it's too small. The boards
usually have a keepout zone on the edges, so the board can ride on
rails as it goes through the IR oven. I'm not aware of the
details of how they're sawed and milled later. At one time,
a cruder technique (tiny boards snapped off along a perforation
line) was the technique of the day. But professionally prepared
product today seems to be milled on all edges. I didn't see
any kind of milling, sawing, or cleaving equipment at my work.
I didn't live at the factory, and only got to visit. We didn't
have a "tightly integrated" manufacturing organization, so I
was spared frequent, long drives, to the factory. One other
company in town, the "factory" is only a hundred feet from
your desk. And you'd never get a moments peace.
*******
I can't think of a material that's a good match for "transparent yellowish"
and belongs on an electronics board. And is chemically strong
enough to remove a finish on the chassis. Normally, any chemicals
are precisely applied, and the curing steps are finished well
before the product leaves the factory.
If BGA chips are used on the PCB, the ball count is low enough
that "underfill" is not required. The material that is used
for underfill, may fit that description. Underfill is used
on things like GPUs or maybe a Northbridge or Southbridge.
Maybe around 1500 balls or so, could use some underfill,
especially if diurnal temperature variation has a wide
enough swing (GPUs that get burning hot). Underfill is used
for stress relief, so the solder balls don't crack or shear off.
If you want to learn more about underfill materials, most have
patents, so you can track down the chemistry that way.
Paul