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Japan approves chip development project with Taiwan's TSMC
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Amine Moulay Ramdane
Jun 1, 2021, 3:50:26 PM6/1/21
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Hello...
I invite you to read how USA Intel company invented an entirely new insulation material to help dissipate heat in there new 3D packaging technology that stacks logic chips atop one another and we call the new
Intel CPU "Lakefield" 3D Chip, read more here to notice it:
https://www.wired.com/story/intel-lakefield/
And Taiwan's TSMC company and Japan want to do the same and there research will focus in particular on tech for 3D chip assembly, allowing the creation of components and chips that are more dense but still small, read carefully the following news so that to notice it:
Japan approves chip development project with Taiwan's TSMC
Read more here:
https://techxplore.com/news/2021-06-japan-chip-taiwan-tsmc.html
Thank you,
Amine Moulay Ramdane.
I invite you to read how USA Intel company invented an entirely new insulation material to help dissipate heat in there new 3D packaging technology that stacks logic chips atop one another and we call the new
Intel CPU "Lakefield" 3D Chip, read more here to notice it:
https://www.wired.com/story/intel-lakefield/
And Taiwan's TSMC company and Japan want to do the same and there research will focus in particular on tech for 3D chip assembly, allowing the creation of components and chips that are more dense but still small, read carefully the following news so that to notice it:
Japan approves chip development project with Taiwan's TSMC
Read more here:
https://techxplore.com/news/2021-06-japan-chip-taiwan-tsmc.html
Thank you,
Amine Moulay Ramdane.
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