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Intel demos first Lakefield chip design using its 3D stacking architecture
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Horizon68
May 6, 2019, 3:17:52 PM5/6/19
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Hello..
Intel demos first Lakefield chip design using its 3D stacking architecture
The Foveros era at Intel is approaching
Lakefield will specialize in lower-power devices with unique hardware
constraints, including foldable phones and tablets, drones, smart home
devices, and other gadgets that require a tiny, all-in-one chip.
Read more here:
https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019
Thank you,
Amine Moulay Ramdane.
Intel demos first Lakefield chip design using its 3D stacking architecture
The Foveros era at Intel is approaching
Lakefield will specialize in lower-power devices with unique hardware
constraints, including foldable phones and tablets, drones, smart home
devices, and other gadgets that require a tiny, all-in-one chip.
Read more here:
https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019
Thank you,
Amine Moulay Ramdane.
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