Moore's Years: 3D chip stacking will take Moore's Law past 2020

[computer45]

Hello,

Read this:


Moore's Years: 3D chip stacking will take Moore's Law past 2020


"Similar to Aquasar, the team plans to design microchannels with
single-phase liquid and two-phase cooling systems using nano-surfaces
that pipe coolants—including water and environmentally-friendly
refrigerants—within a few millimeters of the chip to absorb the heat,
like a sponge, and draw it away. Once the liquid leaves the circuit in
the form of steam, a condenser returns it to a liquid state, where it is
then pumped back into the processor, thus completing the cycle.

As we will demonstrate with ETH in the Aquasar project, employing
microchannels carrying liquid coolants offers a significant advantage in
addressing heat-removal challenges, and this should lead to practical 3D
systems," said Bruno Michel, manager advanced thermal packaging, IBM
Research - Zurich."


Read more here:

https://phys.org/news/2010-03-years-3d-chip-stacking-law.html




Thank you,
Amine Moulay Ramdane.