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Intel Has Figured Out How To Compute In 3 Dimensions And It Could Put The Company Back On Top
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amin...@gmail.com
Dec 8, 2019, 4:53:53 PM12/8/19
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Hello,
Intel Has Figured Out How To Compute In 3 Dimensions And It Could Put The Company Back On Top
If you can’t increase performance by speeding up the chip, then the obvious thing to do is to reduce the distance between chips. That’s the idea behind the architecture called 3D stacking, which integrates different chips together much like the integrated circuit combined various components together on a single chip.
Stacking chips on top of each other would not only vastly reduce the time circuits need to wait for instructions from each other and increase speed significantly. It would also decrease power usage due to far shorter communication paths. It seems like the perfect solution to a thorny problem.
However, this approach comes with its own problems. Because the chips are stacked on top of one another and heat travels upward, they tend to overheat. So while the technique has been used for memory chips, no one has been able to make it work for processing chips.
Until now, that is. That is essentially what Intel has achieved with its Foveros technology. The company has announced that it cracked the problem and that the technology will become available in the latter half of 2019. It is a tremendous achievement and has the potential to put Intel back on top.
Read more here:
https://www.innovationexcellence.com/blog/2019/06/10/intel-has-figured-out-how-to-compute-in-3-dimensions-and-it-could-put-the-company-back-on-top/
Thank you,
Amine Moulay Ramdane.
Intel Has Figured Out How To Compute In 3 Dimensions And It Could Put The Company Back On Top
If you can’t increase performance by speeding up the chip, then the obvious thing to do is to reduce the distance between chips. That’s the idea behind the architecture called 3D stacking, which integrates different chips together much like the integrated circuit combined various components together on a single chip.
Stacking chips on top of each other would not only vastly reduce the time circuits need to wait for instructions from each other and increase speed significantly. It would also decrease power usage due to far shorter communication paths. It seems like the perfect solution to a thorny problem.
However, this approach comes with its own problems. Because the chips are stacked on top of one another and heat travels upward, they tend to overheat. So while the technique has been used for memory chips, no one has been able to make it work for processing chips.
Until now, that is. That is essentially what Intel has achieved with its Foveros technology. The company has announced that it cracked the problem and that the technology will become available in the latter half of 2019. It is a tremendous achievement and has the potential to put Intel back on top.
Read more here:
https://www.innovationexcellence.com/blog/2019/06/10/intel-has-figured-out-how-to-compute-in-3-dimensions-and-it-could-put-the-company-back-on-top/
Thank you,
Amine Moulay Ramdane.
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