How does Plasma improve the quality of my wire bond?

[hoegs]

Plasma cleaning can remove contamination, increase surface energy, and
if desired, even temporarily alter the surface chemistry of the bond
pad, all of which can improve the quality of the wire bond.

The presence of contamination, such as organics from the die cure step
or native oxides, on the metal bond pads inhibits successful wire bonds
and impacts bond yields.

The decreasing bond sizes in advanced packaging applications limits the
force of the bonder, therefore increasing the requirements for
contamination free surfaces.

Plasma is used to remove the contamination or oxidation from the bond
pads prior to wire bonding to increase reliability and bonding yields.

Studies have shown an increase in wire bond strength by 24.3% when
using plasma cleaning.