Why would I need to use gas plasma?

[hoegs]

Today, plasma technology is applied to numerous processes including
surface treatment, thin film deposition and etch, material synthesis,
and machining.

In advanced IC packaging and optoelectronics applications, plasma
processing provides improved reliability and yield of these fine
geometry packages.

Gas mixtures and plasma conditions that produce both physically and
chemically active plasma are used in surface activation and/or in the
surface cleaning process prior to wire bonding, die attach,
encapsulation, conformal coating and other processes.

Plasma processing:

* Eliminates delamination
* Improves wirebond strength
* Promotes void-free underfill
* Removes oxides
* Enhances die attach