Invitación a la charla: 3D Integrated Circuits - Advantages and Challenges
Mariano
3D Integrated Circuits – Advantages and Challenges
Malgorzata
Chrzanowska-Jeske
Electrical and Computer Engineering,
Portland State University
Portland, Oregon, USA
Abstract:
The most significant challenge for continued integration of complex systems is energy efficiency. 3D heterogeneous stacking of diverse circuit blocks is one of the most promising solutions. The tutorial will focus on three-dimensional integrated circuits (3D ICs) consisting of multiple layers of systems integrated vertically using through silicon vias (TSVs). We will discuss advantages and challenges of current 3D TSV-based technologies and how to exploit various options through tradeoffs and well-educated choices for designing energy efficient heterogeneous systems. Comparisons between various TSV models and layout solutions will be presented and discussed. Influence of TSV-induced thermo-mechanical stress on devices and interconnects will be discussed. Influence and design trade-offs of temperature distribution on system performance and power dissipation will be discussed. As time permits we will also look towards the horizon, exploring monolithic 3D systems, a variety of new materials such as carbon-nanotubes, and the potential of an abundance of energy efficient interconnects.
Malgorzata
Chrzanowska-Jeske
is Professor of Electrical and Computer Engineering and Director of
the VLSI & Emerging Technology Design Automation Laboratory at
Portland State University. From 2004 to 2010 she was Chair of
the ECE department at PSU, which she joined in 1989. Previously,
she has served on the faculty of the Technical University of Warsaw,
and as a design automation specialist at the Research and Production
Center of Semiconductor Devices in Warsaw. She holds M.S. degree in
electronics engineering from Politechnika Warszawska (the Technical
University of Warsaw) Warsaw, Poland, and the PhD degree in
electrical engineering from Auburn University, Auburn, Alabama.
Her
research interests include CAD for VLSI ICs, MS-SOCs, 3D ICs,
nanotechnology and nano/bio systems, design for manufacturability and
design issues in emerging and renewable technologies. She has
presented tutorials, keynote and invited talks at various
international conferences and events. She has published more than 150
technical papers and serves as a panelist and reviewer for the
National Science Foundation (NSF), and as a reviewer for National
Research Council Canada (NRC) and many international journals and
conferences. Her research has been supported by the NSF and
industry.
Dr.
Chrzanowska-Jeske has served in various roles on the Technical,
Steering, and Organizing Committees of many international conferences
and workshops, and as Senior Editor, Associate Editor and Guest
Editor of international journals. Currently, she serves as Associate
Editor for Transactions on Circuits and Systems II. She
served for two terms on Board of Governors of IEEE Circuits and
Systems Society (CASS) where she was also Chair of the Distinguished
Lecturer Program and Chair and a founding-member of Women in CAS.
Currently,
she serves as Vice President for Technical Activities for the IEEE
Nanotechnology Council (NTC), and is
chair elect of Nanoelectronics and Giga-scale Systems Technical
Committee of the IEEE Circuits and Systems Society.
She
presented keynote, plenary and tutorial lectures at various
international conferences.
She
received the Best Paper Award from Alabama Section of IEEE for the
best IEEE Transaction paper in 1990 and IEEE Council on Electronic
Design Automation 2008 Donald O. Pederson Best Paper Award in IEEE
Transactions on Computer-Aided-Design of Integrated Circuits and
Systems.