On Dec 10, 9:48 pm, Charlie_VelvetPoster <
CharlesJen...@cox.net>
wrote:
> Does anyone have any idea how difficult it would be to fabricate a
> little prototype used for a proof of concept of CIHT? Is there enough
> info in the patents to make this?
If you have a vacuum system and equipment to deposit films using
evaporation and/or sputtering, it would probably not be all that
difficult. BUT ...
We are (or at least I am) thus far only speculating about the possible
configuration of BLP's CIHT process based on mockan1's Dec 05 post.
Assuming the speculation is close, there is undoubtedly some critical
materials engineering to be done to make a working prototype. Even
more engineering will be required to make something that will work
reliably with a long lifetime in an environment of high temperature
hydrogen.
For a basic CIHT cell, you would have to make two relatively simple
sub-assemblies. The first would consist of a thin square or
rectangular alumina plate with a number of small holes drilled through
it and both sides coated, except for a space around the periphery,
with a metallic conductor (copper?) sufficient to carry a couple of
amps per square centimeter to one edge. The through holes would also
be filled with the conductor. One side of the plate would have a high
temperature p type semiconductor (silicon carbide?) sputtered over
the metallic layer. It may also be necessary to evaporate an
intermediate layer under the semiconductor to establish an ohmic
connection to the conductor. On two opposite uncoated edges, a non-
conductive spacer (quartz?) a few thousandths of an inch thick would
be fused to the ceramic.
The second sub-assembly would consist of another thin ceramic plate of
the same size but made of beta alumina. One side of this, except for
a similar gap around the edges, would be coated with a porous
conductive layer. (This might be done by evaporating an alloy layer
and chemically dissolving one component.?) A very thin conductive
corrugated sheet spring would be attached to this layer (beryllium
copper?) . A non-conductive spacer of thickness sufficient to allow
the corrugated spring to compress slightly would be fused to three
sides of the uncoated edge.
A basic cell would consist of the first plate mounted against the
second with the top being the positive plate and a metal plate
compressing the corrugated spring, the negative. Potassium hydride
(EG.) vapour would enter the gap between the two plates and that plus
hydrogen and hydrions would exit the opposite side. Potassium vapour
would exit the gap between the second plate and the metal plate. The
hydrino reaction would take place in the gap between two alumina
plates as described in mockan1's post.
A CHIT battery would consist of perhaps a hundred pairs of such cells
stacked in proper alignment and clamped together in a manner that
allows for thermal expansion. A plenum on one side would carry KH
into the stack, a plenum on the other would carry unreacted KH, H2 and
dihydrino gas out of the cell. A third plenum on one side would carry
K vapour out of the cell. Now all you need to do is to provide the
necessary KH gas to the cell, extract the dihydrino gas, add H2 gas to
reform the K gas to KH to replace that converted to hydrinos.
This is likely beyond the capabilities of most amateurs, but clearly
this could be relatively easily done in high volume by automated
equipment and for relatively low cost. But, if you can do that in
your basement workshop, go for it.