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TheADPA1113-EVALZ is a 2-layer printed circuit board (PCB) fabricatedfrom 10 mil thick Rogers 4350B copper clad mounted to analuminum heat spreader. The heat spreader provides thermal reliefto the ADPA1113 and mechanical support to the PCB. Mountingholes on the heat spreader allow it to be attached to larger heatsinksfor improved thermal management. The RFIN and RFOUTports are populated by 2.92 mm female coaxial connectors, andtheir respective RF traces are of 50 Ω characteristic impedance.The ADPA1113-EVALZ is populated with components suitable foruse over the entire operating temperature range of the ADPA1113.

The RF traces are 50 Ω grounded coplanar waveguides, and thepackage ground leads connect directly to the ground plane. Multiplevias are used to connect the top and bottom ground planes. Thepackage base, along with an indium foil shim, is mechanically connectedto the heat spreader using four, 0-80 3/16" stainless steel,socket head screws to ensure adequate electrical and thermalconduction.

The power supply decoupling capacitors shown in Figure 5 representthe configuration that was used to characterize the device.Note that it is possible to reduce the number of capacitors; however,this reduction varies by system. Instead, it is recommended tofirst remove or combine the largest capacitors that are farthest fromthe device.

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