Synopsys Vcs Crack

0 views

Skip to first unread message

Message has been deleted

Frank Belair

unread,

Jul 16, 2024, 7:30:04 PM7/16/24

to bhutimtuyhu

"Our longstanding collaboration has delivered leading-edge SoC designs. This is a remarkable milestone to successfully achieve the highest performance, power and area on the most advanced mobile CPU cores and SoC designs in collaboration with Synopsys," said Kijoon Hong, vice president of SLSI at Samsung Electronics. "Not only have we demonstrated that AI-driven solutions can help us achieve PPA targets for even the most advanced GAA process technologies, but through our partnership we have established an ultra-high-productivity design system that is consistently delivering impressive results."

"The relentless demand for ever-better PPA and energy efficiency in high-performance mobile chips is driving the need for high-performance core-specific EDA optimization across the full stack," said Shankar Krishnamoorthy, General Manager of the EDA Group at Synopsys. "Our extensive set of PPA-boosting capabilities targeted for CPUs and GPUs across the Synopsys AI-driven EDA suite and IP portfolio enables our mutual customers to successfully design chips with the highest quality-of-results for the most advanced Samsung GAA processes."

Synopsys Vcs Crack

Download https://ckonti.com/2yLJ0E

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

Synopsys is applying NVIDIA accelerated compute architectures, including the NVIDIA GH200 Grace Hopper Superchip, to achieve significant, projected runtime gains of up to 15X compared to current methods, across the full EDA stack spanning design, verification, simulation and manufacturing. Specifically:

In addition, Synopsys and TSMC are going to production with NVIDIA cuLitho, a computational lithography platform, to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.

Synopsys is extending its Synopsys.ai LLM-based capabilities, beginning with Synopsys.ai Copilot, to support NVIDIA AI and compute platforms, giving customers more flexibility to customize their data sets and enable air-gapped on-prem deployment. Synopsys.ai Copilot is an industry-first generative AI capability that is designed to help engineering teams accelerate time to market and address systemic complexity through the power of conversational intelligence.

Together, these capabilities can provide engineering teams with a digital twin of both the vehicle electronics and the environment, allowing them to test and validate embedded software, safety and autonomy features well ahead of production. Synopsys expects to begin engaging with lead customers on the solution in the second half of 2024, with general availability expected in 2025.

Consumer demand for feature-rich, power-efficient smart devices is driving silicon design complexity to new heights, with chips containing more than 100 billion transistors already available today. To meet this growing demand, designers are employing the latest chip manufacturing technology processes, which are now entering the angstrom era. Additionally, advanced 3D packaging techniques and chiplets are becoming mainstream and are adding even more complexity that needs to be taken into account.

These requirements are driving the need for unprecedented computational growth for EDA and system analysis workloads that can peak as high as 400 percent as compared to older designs and manufacturing nodes. These workloads ebb and flow over the course of a project and design teams need scalable, pay-per-use models for EDA licenses and infrastructure in order to complete projects efficiently and economically.

Amazon Web Services (AWS) offers a broad choice of EDA-optimized compute instance types available in the Amazon Compute Cloud (EC2) and high-performance storage options that are globally available, providing an excellent choice for running EDA workloads at scale. Industry-leading customers, including Arm, NXP, Marvell, Alphawave and Astera Labs, are running semiconductor workloads on AWS today and are realizing the power of the cloud for accelerating their chip design schedules and lowering costs. In fact, Alphawave recently reported that by running on AWS, it was able to shorten its tapeout schedule by almost 1.5 months, and cloud costs were only 5 percent of the overall project cost.

However, compute and storage are not the only necessary resources for running EDA workloads at scale; EDA licenses are a major factor as well. Generally, semiconductor companies acquire a specific numbers of EDA licenses, and the number of licenses limits the number of concurrent jobs an organization can run. For example, if an organization only has 500 simulation licenses, then it can only run 500 simulations simultaneously, even when more computational resources are available. To truly use the elasticity and scalability provided by the virtually unlimited compute capacity of AWS, these companies need much more flexible licensing solutions.

Synopsys Cloud Bring Your Own Cloud (BYOC) with FlexEDA, which is available through the Synopsys Cloud BYOC solution on AWS and has a scalability and cost model very similar to that of Amazon EC2, which offers secure and resizable compute capacity for virtually any workload. Customers can scale as needed and only pay for what they use. The solution is very well suited for high-scale execution of EDA simulations and can be cost neutral at scale. For example, the cost of running simulations for 10 hours on 100 servers is the same as running for 1 hour on 1,000 servers because license and Amazon EC2 usage for both cases is 1,000 CPU hours.

The Synopsys Cloud BYOC with FlexEDA model helps designers to overcome the dependency on EDA licenses by providing access to instant, unlimited EDA licenses. These licenses are available on a per-minute or per-hour basis through the Synopsys Cloud solution under a true pay-per-use model. With a Synopsys Cloud BYOC with FlexEDA deployment on AWS, customers can

The reference architecture for deploying Synopsys Cloud BYOC with FlexEDA is shown below. For each customer Synopsys will implement the FlexEDA license management and metering service in an Amazon Virtual Private Cloud (VPC) provided by Synopsys and dedicated to that particular customer. The customer will enter their requirements including license and budget counts within the Synopsys Cloud Control Plane which will in turn set up the license file in the Synopsys Cloud AWS VPC for that customer, as shown in the following Figure 1.

Running EDA workloads on AWS has numerous benefits, including lowering costs, improving efficiency, improving design quality, and reducing time to market. However, fully using the scale of the cloud requires a scalable EDA licensing model. Synopsys has addressed this need with Synopsys Cloud BYOC with FlexEDA. To learn more and request a free evaluation of Synopsys Cloud BYOC with FlexEDA on AWS, please visit synopsys.com/cloud. To learn more about general semiconductor solutions on AWS, please visit AWS for Semiconductor and AWS Blogs for Semiconductor.

SUNNYVALE, Calif., Nov. 15, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced a breakthrough generative artificial intelligence (GenAI) capability for accelerating chip design, Synopsys.ai Copilot. The new capability is the result of a strategic collaboration with Microsoft to integrate Azure OpenAI Service that brings the power of GenAI into one of the most complex engineering challenges - the design process for semiconductors.

"The semiconductor industry is racing to develop faster, more efficient, and optimized computing, which is also driving complexity. At the same time, we're facing a projected 15% to 30% workforce gap for chip design engineers by 2030," said Shankar Krishnamoorthy, general manager of the Synopsys EDA Group. "AI-driven design can help address these challenges. Synopsys pioneered AI-driven design with our Synopsys.ai EDA suite. Now, working collaboratively with Microsoft, we're taking AI-driven design to the next level with generative capability such as conversational intelligence delivered in this first Synopsys.ai Copilot."

"Our history with Synopsys is built on a shared vision for accelerating semiconductor innovation through Cloud and AI," said Corey Sanders, corporate vice president, Microsoft. "Microsoft's engineering teams worked closely with Synopsys to bring the transformational power of Generative AI to EDA, which will empower semiconductor design engineers using the Synopsys.ai Copilot with the best AI infrastructure, models, and toolchain built on Microsoft Azure."

The combination of AI-powered design capabilities available at scale on high-performance infrastructure can deliver a step-function improvement in helping engineering teams innovate faster and more efficiently. Synopsys.ai Copilot is available now for early-access customers. For more information: www.synopsys.ai.