ASQ RD Webinars Jan 14
Fred Schenkelberg
Join us for one or more of our upcoming webinars in January 2014
Let me know what topics are of interest to you and we'll see about finding speakers. Please recommend speakers you'd like to hear or propose a topic yourself.
Improved QFN Reliability Process
January 9, 2014 09:00 US Pacific Coast Time
https://www1.gotomeeting.com/register/496722896
Presenter:
Lenora Toscano
Abstract
The adoption and use of various Quad Flat Pack (QFP) designs in today’s electronics market has grown faster than originally expected. With the increase in usage there is increased demand on the inspection and reliability of these components. The design of the component is such that currently, the entire solder joint is made under the component which causes difficulty in inspection. X-ray inspection is widely used though some have argued that x-ray will not detect all the potential solderability issue on the bottom side of the component. As a result the request for a toe fillet has been discussed.
The process of singulating IC packages such as QFNs by either a sawing or punching operation results in exposed copper on the sidewalls. This exposed copper surface can oxidize leading to poor or no solder wetting up the sidewall during the assembly operation. The consequence of this oxidized copper surface is either incomplete or no solder fillet formation during the PCB mounting operation resulting in solder joint reliability concerns. Currently, JEDEC and IPC assembly standards do not specify a toe fillet for assembly. However, several component manufacturers have requested a toe fillet solderability process which would improve current QFN reliability by ensuring toe fillet solder coverage. A process whereby tin is plated on the copper sidewall of the QFN after singulation has been developed to improve toe fillet solderability. Several assembly studies have been conducted which demonstrate improved QFN reliability due to the use of this toe fillet solderability process. The plating process, toe fillet inspection and improved QFN reliability after assembly due to the use of this toe fillet solderability is described.
Impacts of Censored Data on Reliability Estimation and Life Test Planning (截尾数据对于可靠性估计和寿命试验计划的影响)
January 11, 2014 18:00 US Pacific Coast Time
https://www1.gotomeeting.com/register/636880536
Presenter:
Dr. Rong Pan 潘荣 博士
Abstract
Presented in Chinese
Data censoring is a staple feature of reliability data analysis. In this talk, we will discuss several different types of censored data – where they are from, how to recognize the censoring type, and how format the data for analysis. More importantly, the data analyst should understand the impacts of different types of censoring on reliability estimation and life test planning, so as to avoid some typical pitfalls caused by ignoring censoring or by using wrong types of censoring. We will demonstrate the value of performing Monte Carlo simulations for studying the impacts of censoring and for evaluating a life test plan.
Cheers,
Fred
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Fred Schenkelberg
ASQ RD Webinar Executive Producer
@fmsreliability
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