I believe you are talking about using heat sinks/fans/etc to cool
electronics such as CPU's, high speed chips, hi-power transistors, etc???
You're probably out of luck.
I'm not an engineer, but I know a little on this subject. The variables
involved are:
the vector power consumption of the device
the efficiency of the device (possibly also a vector if it changes
non-linearly with power changes)
the heat transfer coefficient of the device
the heat transfer coefficient of the device-to-heat-sink junction (this
includes variables involving the materials of the case/heatsink, the type
and thickness of the layer of heat sink compound, and surface area/flatness
of the case/heatsink)
the heat transfer coefficient of the heatsink (includes surface area,
material, flatness, airflow characteristics, et al, but is usually given by
the heatsink manufacturer IF you stick to their pre-ordained conditions of
ambient temp, airflow, etc...)
the ambient temperature and humidity.
the amount of air flowing over the heatsink.
If you enclose this all in a case, then you have to figure another set of
heat transfer calculations involving heat in/out of the case. As you can
see, this is quite a complicated beastie, and as such is only taken on by
deep-pocket corporations or college physics classes. When you factor in the
very low demand, an economic equation will tell you the cost is going to be
astronomical (Hmm.. physics, economics and astronomy in one lesson! :-)
Best of luck!
"Dr. Savak" <drs...@home.com> wrote in message
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