A fiberglas substrate, can have copper tracks on one side, or
on both sides.
The cheapest consumer items, have copper tracks on just one side.
This reduces the material cost of the PCB to make the item. Some of
the connections on such cheap items, are made by jumper wires.
High tech items like computer motherboards, use multilayer boards.
These are a "sandwich" of the simpler type of substrates, pressed
together in a big press. A 4-layer board would be two 2-layer
substrates, joined together. At work, we used PCBs with 12 layers
to 16 layers, and the blank PCBs can cost as much as $300 each
depending on features.
When you have plenty of layers, there is no need to run tracks between
the legs of the capacitors. You can run solid copper or cross-hatch
copper on the outer layers for copper balance or EMI containment,
and hide the actual signal tracks inside the PCB. And the thickness
of the copper, defines its current carrying capability. Thickness
is 1/2 oz, 1 oz, 2 oz, and a "power board" might use 2 oz for all
layers. The thicker the copper, the narrower the track can be,
for a given current carrying capability.
When signals pass from one layer to another, that is done with a "via".
The central cylinder of copper is the "fillet" and is plated up. First
you drill the hole through the laminated board. Then, you plate
copper into the hole, to build up the walls. The plated copper conducts
from one side of the board to the other, and joins any copper on
inner layers that touch the sides of the hole. The minimum diameter
of a signal via is limited by the "aspect ratio" of the hole, and
the thicker the PCB is, the larger the diameter of via is required
for a given aspect ratio.
https://en.wikipedia.org/wiki/Via_(electronics)
Holes for the electrolytic capacitor legs, are a larger diameter,
but use a similar construction. There can be copper rings on
top and bottom of the hole, or a copper ring just on the side
with the copper. The rules for constructing PCBs, takes
a stack of paper two feet thick, and I don't know all those
rules by heart. But I have worked with people who have memorized
practically the whole thing, just by using the specs. And I consult
with them, for the correct construction of things like that.
For high voltage circuits, there are "creepage and clearance"
requirements, and some copper constructs are not used, because
of the danger of a short underneath something, if enough dirt,
dust, or debris collects over the life of the item.
http://blog.optimumdesign.com/clearance-and-creepage-rules-for-pcb-assembly
The plated holes under the cap, would either refer to the top
of the hole the legs of the capacitor uses. Or would refer to
via conductors unrelated to the capacitors. And a designer
wouldn't necessarily want to put vias in that area.
There really shouldn't be glue under the cap. The glue selected
should be viscous enough to stay put where it is applied. There
are liquid underfills in electronics, that "flow" underneath
things on purpose, but this is not an example of where to use
them. I can see they've applied glue around the base ring
of the capacitor, and that's about as close as it gets.
Putting glue underneath the capacitor before installing it,
would be a mistake. The whole purpose of the glue, is
mechanical rigidity, and gluing the capacitor plastic sleeves
to one another, helps just as much as gluing the base
of the capacitor to the PCB, but is "safer".
A good electronics design is "re-workable". That means on
the manufacturing line, if a component is defective, staff
can remove the component and put in a good one, and still
sell the item. This reduces the pile of junked electronics
in the garbage, outside the plant. Glue should only be applied
after the board is tested and known to be good electronically.
And selecting the chemicals used for stuff like this, is
pretty difficult. If you want the item to have a long life,
you cannot use just any old glue. Good industrial glues
exist for a reason, and I suspect the glue used in the
S750 was "whatever is the cheapest", as the glue was susceptible
to heat.
Paul