IGBT, MOSFET, HVFET rf hv frequency, power electronics converter - Hi-Tek-Peru

1 message - Collapse all

wernado

View profile

More options May 8, 8:40 am

From: wernado <stephenobr...@gmail.com>

Date: Fri, 8 May 2009 05:40:27 -0700 (PDT)

Local: Fri, May 8 2009 8:40 am

Subject: IGBT, MOSFET, HVFET rf hv frequency, power electronics converter

  Reply to author
  |
  Forward
  | Print
  | Individual message
  | Show original
  | Report this message
  | Find messages by this author
  

Introduction
high-tech operate engineering company IPM develops and patent grant
DE10328937 a dual high power, high voltage, high frequency switching
unit which works with hybrid drives, compact EMI safe semiconductor
power electronic stage, supporting capacitors and high voltage ferrite
transformers to generate ultra short HV pulses and sparking groups.
Advantages are based on uses of standard circuits with extended
semiconductors for e.g. micro perforation applications, corona
treatments, ac/ac, ac/dc converter, drives, etc.

IPM is looking for science or industrial partners who are interested
in a licence agreement and/or technical cooperation for other wide
application fields.

Working principle
Industry application of electrostatic perforation or AC/AC, AC/DC
converting, drives, etc. IGBT, MOSFET, HVFET semiconductor power
stages. The circuits are working as upward converters with extremely
short time power pulses in ranges from 200 ns up to 15 micro second,
high current peaks up to 300 Amps by du/dt of 1,500V/µs on a serial
connected inductivity and loading condenser that the secondary ferrite
transformer coils supply the sparking electrodes up to 50 KVss as a
permanent open loop and short circuit.

A safety circuit logic and two hybrid drivers allows a alternately
switching of semiconductor A/B which generating higher operation
frequencies and power levels meanwhile the electrical and thermal
conditions remains on each in the same range as a single switching
unit.

In conclusion the approximately double frequency and power level
operation obtains higher switching efficiencies, more perforation
power or higher corona treatment level, depend of the industry
application.

Advantages
Dual IGBT, HVFET or MOSFET semiconductors in high power, high current,
high voltage circuits obtains in electrostatic nano or micro
perforation, surface treatment, surface modifications, corona
treatment, converters, drives or other switching application
frequencies up to 250 KHz, 1,400 V/ce, power levels up to 30 KW and
more. Higher power efficiencies and worse switching periods are
further advantages.

An control pulse timing into a certain time window with a constant or
variable frequency generates holes sizes and hole sequences with high
voltage sparking through the material webs.

The repeating frequencies of the entire circuit can up to the double
switching frequency of each semiconductor.

For example by electrostatic perforation porosity range from 80 C.U.
up to 2,500 C.U., paper web speeds up to 450 m/min and web widths up
to 2,000 mm are archive able.

Other applications
Corona treatment units, surface treatment, high power switching
devices, power supplies, AC/DC power drives, AC/DC or AC/AC
converters, laser diode power supplies, compact switching converter
systems, etc.

The new dual semiconductor allows applications to build hybrid drives,
semiconductor high-level stage, upward, downward or other converters
or generators which operating with supporting capacitors, high-voltage
ferrite transformers in an extremely compact and modular way. Several
advantages are the high efficiency of pulse/power transmission and
energy ratios.

Traditional corona or other medium frequency generators up to 30 KHz
operation range are easy to modify to double frequency and power
levels.

Patent grand for process and device DE10328937 of IGBT power switching
unit.

Future prospects
The electrostatic ESP nano or micro perforation in pore ranges from 10
nano up to 100 microns usually applies within ranges of the refinement
of fine paper, packaging webs, bonded fabrics, non-woven, filter
paper, bag or booklet paper webs of most diverse kind especially when
additionally treating course materials for achieving special
characteristics which for physical or process reasons cannot be
achieved by other process technologies.

Our highly modern, industrially approved ESP perforation technology
operation which even can be relied on when operated 24/7 can be
integrated into existing rewinding course devices or other course
devices. Also, they can be used as completely independent perforation
devices.

Micro Perforation
Perforation results are now achieve for nano or micro perforation of
flexible webs with ultra small pores and products made of these
materials. Materials finishing are of interest for numerous tasks in
the field of packaging, in filling, non woven industry, for technical
and science applications, etc. For many years fine and other paper
webs with base weights between 20 up to 150 g/m2 have been perforated
electro statically in large areas or zone designs. Pore sizes from 10
nano to 100 microns, pore distributions of up to 10 Million/m2 in area
perforation or respectively 2OO/sqcm by zone perforation by up to 16
Million holes per Second can be reached. Air permeabilities or
porosity ranges are among from 50 up to 2,500 C.U. (ml/sq2/min)
respectively 3 to 50 l/m2/sec. (Franksystem) are now possible. Web
width from 100 to 2,000 mm at speeds of up to 500 m/min, depending on
porosity and material consistency in relation to it’s ability to
perforate.

New ranges of applications will be made accessible as new products
with special features will be developed.

http://www.microperforation.com/igbt-esp-unit.html

27.02.2008 - Flexo & Gravure Asia 1-2008
http://www.flexo.de/download/fga/1-2008/Inhalt_FGA_1_2008.pdf

Tobacco China http://www.tobaccochina.com/news/data/20038/c815083548.htm

--------------------------------------------------------------------------- ------------------------------------------------------

Outstanding Micro Cluster Patent Production Technologies

MLL-1 anti piracy micro laser treatment, line perforation real
alternative for galvanometer scanner, cluster micro technology for
hole pattern, perforation design, waves, zigzag or packages lines,
cryptograms, company logos, holograms, anti counterfeiting, security
paper, safety, bank note, metal sticker, printing, laminating,
coating, fruit, food, bread, vegetable, agriculture covering, credit
cards, transparent films, holographic paper, cigarette, tipping,
filter, aluminum foil, shrinkable film, tear tapes, labels,
cardboards, bar or matrix codes, marking, scribing, jewelry,
automotive, pharmacy, golf, smoking, chemical or medical product,
electronics part, indicators, porosity contours or profiles,
embossing, bioengineering, membrane, filtration, focus, holographic,
hinge-lid, pack, hole, porous, hole, line, micron. Patent pending
DE102004012081.

LPM-1 micro laser cluster perforation or other material treatment at
wide web, large area, surface or whole material cluster treatment,
cutting, welding, drilling, ablation, cleaning, melding, high power
dual rotation laser beam splitter, twin multiplexer level, 2/4 KW
optical input, flexible hollow fibers, 200 output channels, Co2,
diode. Material treatment and robotic handling for stainless steel,
ceramic, aluminum, wafer, gold, glass, silver, brass, copper, wafer,
silicon, titanium, diamonds, jewelry, silicon, solar, panel,
photovoltaic, micromachining, slitting, rewinding, refining machines
or stand along systems. Patent grant DE102004001327.

Nano Micro perforation or other material surface treatment,
electrostatic cluster perforation for cigarette, tipping, filter,
packaging, plug wrap, craft, cement sack, bag, fine and other paper,
silicon or other coatings, certain plastic films, laminates, porosity
from 80 up to 2,500 C.U., from 20 down to 6 Gurley, hole sizes from 50
nm up to 100 microns, hole densities from 80-260 h/cm2, zone widths
from 2.0-6.0 mm, up to 16,000,000 holes per Second, web speeds up to
500 m/min, web widths up to 2,000 mm. Patent grant DE10328937.

Twin AC/AC, AC/DC frequency shift converter high power, high
frequency, high voltage, ultra short mega peak current, electro static
nano or micro cluster perforation, ignition, sparking, arc, cigarette,
tipping, filter, fine, packaging, paper, plug-wrap, sack, bag, Kraft,
food, plastic film, foil, textile, fabrics or other products,
switching converter, compressor, emergency, train, ship or vessel
power supply, generator, fuel cell, upward, downward, frequency shift
switching unit, stabilizer, soft starter, vector, phase, inverter,
servo system, motion, stepping, spindle, CNC, machine, asynchronous,
standard, motor, torque, automation, remote, gas, slab, laser, diode,
stack, fiber, beam, material, hybrid, plug-in, car, battery, lithium,
Ion, renewable, energy, wind, solar, panel, technology, recycling,
medical equipment, membrane filtration, robotic, photovoltaic,
industrial automation, drives, IGBT, MOSFET, FRETFET, HVFET, tube, rf,
hv. Patent grant DE10328937.

Optical online OPSS-1 porosity vision scanning control system
permeability cluster control for electrostatic or laser micro
perforation machines, multiple color sensor head, spectral intensity,
DSP, FPGA, CCD, line, precise, laser, position, material finger print
detection, VIS wave length, opacity, defects, inspection, image
control, scanner systems, process software, line, camera, vision
control, filter, tipping, cigarette, book, packaging, magazine, bible,
wall, Kraft, paper, carton, coffee, tea, food, co-extrusion foils,
films, agriculture, cement, domestic or other moving fabrics or web
material. Patent pending DE10251610. China patent grant 200310104764.

Optical dynes or surface tension control ODSTM-1 at fast moving
substrate, plastic, film, foil, tear tape, laminate, co-extrusion,
BOPP, LLDPE, PE, PP, PVC, MOV, MOH, FEP, PET, OPP, PTFE, MPET, online,
spectral, extinction, monolithic, sensor, analyzing, measurement, wave
length, Raman, stray, beaming, water drop, angle, inspection, corona,
plasma jet, laser, IR, NIR, scanning, wobbling, stray light,
spectrometer. Previous patent application DE19543289.

----------------------------------------------------------------------

Honorary China Yunnan Government
http://bfe.yxrs.gov.cn/article.asp?id=2005092011030968
http://www.tobaccochina.com/news/data/20038/c815083548.htm
http://tobaccoreportermagazine.com/china/2004/Dec04China/Industry%20B...

更多信息请联系
IPM- International Perforation Management 国际工程管理公司
high-tech engineering – China - Germany - Thailand
Mr. Werner Grosse 威尔那.克罗瑟先生
传真 tel/fax: 0049-3212-5097465
网址：http://www.microperforation.com
网站 : http://www.microperforation.com.cn
网站 : http://www.deguodaguan.com/ipm/
网站 : http://www.dk3qv.de

----------------------------------------------------------------------

Reply to author Forward

End of messages

« Back to Discussions

« Newer topic

Older topic »